Yoonsoo LEE

Person

Incheon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a spacer with a junction cooling pipe
- Patent number 11,201,105
- Issue date Dec 14, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having junction cooling pipes embedded in sub...
- Patent number 10,607,919
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS
- Publication number 20240266252
- Publication date Aug 8, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET
- Publication number 20240162117
- Publication date May 16, 2024
- Semiconductor Components Industries, LLC
- Yoonsoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20220093487
- Publication date Mar 24, 2022
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20200185305
- Publication date Jun 11, 2020
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20180315681
- Publication date Nov 1, 2018
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS

Yoonsoo LEE

Person

Patents Grantslast 30 patents

Integrated circuit direct cooling systems having substrates in cont...

Semiconductor package having a spacer with a junction cooling pipe

Semiconductor package having junction cooling pipes embedded in sub...

Patents Applicationslast 30 patents

SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS