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Yoshiaki Hagiwara

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 9,812,421
    • Issue date Nov 7, 2017
    • Nippon Steel & Sumikin Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Rubber kneading method
    • Patent number 4,840,491
    • Issue date Jun 20, 1989
    • Bridgestone Corporation
    • Yoshiaki Hagiwara
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents