Yoshiaki Sakaniwa

Person

Saitama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Insulating resin circuit substrate
- Patent number 12,177,962
- Issue date Dec 24, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated circuit substrate manufacturing method
- Patent number 12,133,338
- Issue date Oct 29, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating circuit board
- Patent number 12,108,528
- Issue date Oct 1, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink integrated insulating circuit board
- Patent number 12,068,219
- Issue date Aug 20, 2024
- Mitsubishi Materials Corporation
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating circuit substrate and method for producing insulating ci...
- Patent number 11,222,835
- Issue date Jan 11, 2022
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFAC...
- Publication number 20230411266
- Publication date Dec 21, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING RESIN CIRCUIT SUBSTRATE
- Publication number 20230319975
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR INSULATING RESIN CIRCUIT SUBSTRATE
- Publication number 20230207333
- Publication date Jun 29, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD
- Publication number 20230127557
- Publication date Apr 27, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK INTEGRATED INSULATING CIRCUIT BOARD
- Publication number 20230071498
- Publication date Mar 9, 2023
- MITSUBISHI MATERIALS CORPORATION
- Toyo Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING CIRCUIT BOARD
- Publication number 20220159829
- Publication date May 19, 2022
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING INSULATING CI...
- Publication number 20210020557
- Publication date Jan 21, 2021
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiaki Sakaniwa

Person

Patents Grantslast 30 patents

Insulating resin circuit substrate

Insulated circuit substrate manufacturing method

Insulating circuit board

Heat sink integrated insulating circuit board

Insulating circuit substrate and method for producing insulating ci...

Patents Applicationslast 30 patents

HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFAC...

INSULATING RESIN CIRCUIT SUBSTRATE

MANUFACTURING METHOD FOR INSULATING RESIN CIRCUIT SUBSTRATE

INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD

HEAT SINK INTEGRATED INSULATING CIRCUIT BOARD

INSULATING CIRCUIT BOARD

INSULATING CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING INSULATING CI...