Yoshiaki UEDA

Person

Shiga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor element housing package and semiconductor device equi...
- Patent number 8,847,381
- Issue date Sep 30, 2014
- Kyocera Corporation
- Yoshiaki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting device and package for housing device employ...
- Patent number 8,837,164
- Issue date Sep 16, 2014
- Kyocera Corporation
- Kazuhiro Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and electronics device using the structure
- Patent number 8,450,842
- Issue date May 28, 2013
- Kyocera Corporation
- Yoshiaki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component-housing package and electronic device
- Patent number 8,405,200
- Issue date Mar 26, 2013
- Kyocera Corporation
- Yoshiaki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component storing package and electronic apparatus
- Patent number 8,242,387
- Issue date Aug 14, 2012
- Kyocera Corporation
- Atsurou Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component case and battery and electric double layer cap...
- Patent number 7,525,049
- Issue date Apr 28, 2009
- Kyocera Corporation
- Manabu Miyaishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ELEMENT HOUSING PACKAGE AND SEMICONDUCTOR DEVICE EQUI...
- Publication number 20130307135
- Publication date Nov 21, 2013
- KYOCERA CORPORATION
- Yoshiaki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate For Mounting Device and Package for Housing Device Employ...
- Publication number 20110273846
- Publication date Nov 10, 2011
- KYOCERA CORPORATION
- Kazuhiro Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic-Component-Housing Package and Electronic Device
- Publication number 20100200932
- Publication date Aug 12, 2010
- KYOCERA CORPORATION
- Yoshiaki UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Storing Package and Electronic Apparatus
- Publication number 20100059271
- Publication date Mar 11, 2010
- KYOCERA CORPORATION
- Atsurou Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND ELECTRONICS DEVICE USING THE STRUCTURE
- Publication number 20080230890
- Publication date Sep 25, 2008
- Kyocera Corporation
- Yoshiaki UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Container, Battery or Electric Double Layer Capacitor Using the Sam...
- Publication number 20070182379
- Publication date Aug 9, 2007
- KYOCERA CORPORATION
- Yoshiaki Ueda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic component case and battery and electric double layer cap...
- Publication number 20060044738
- Publication date Mar 2, 2006
- Kyocera Corporation
- Manabu Miyaishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Yoshiaki UEDA

Person

Patents Grantslast 30 patents

Semiconductor element housing package and semiconductor device equi...

Substrate for mounting device and package for housing device employ...

Structure and electronics device using the structure

Electronic-component-housing package and electronic device

Electronic component storing package and electronic apparatus

Electronic component case and battery and electric double layer cap...

Patents Applicationslast 30 patents

SEMICONDUCTOR ELEMENT HOUSING PACKAGE AND SEMICONDUCTOR DEVICE EQUI...

Substrate For Mounting Device and Package for Housing Device Employ...

Electronic-Component-Housing Package and Electronic Device

Electronic Component Storing Package and Electronic Apparatus

STRUCTURE AND ELECTRONICS DEVICE USING THE STRUCTURE

Container, Battery or Electric Double Layer Capacitor Using the Sam...

Electronic component case and battery and electric double layer cap...