Yoshiaki YUKIMORI

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for mounting conductive ball
- Patent number 10,804,239
- Issue date Oct 13, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting conductive ball
- Patent number 10,804,240
- Issue date Oct 13, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid pressure actuator
- Patent number 9,726,204
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Masato Kajinami
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Grant
Semiconductor manufacturing apparatuses comprising bonding heads
- Patent number 9,508,577
- Issue date Nov 29, 2016
- Samsung Electronics Co., Ltd.
- Byung Joon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recognition apparatus, recognition method, mounting apparatus, and...
- Patent number 9,319,593
- Issue date Apr 19, 2016
- Samsung Electronics Co., Ltd.
- Ueyama Shinji
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and method of recognizing an object, and apparatus and me...
- Patent number 9,218,654
- Issue date Dec 22, 2015
- Samsung Electronics Co., Ltd.
- Ueyama Shinji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus and mounting method for flip chip bonding semico...
- Patent number 9,209,051
- Issue date Dec 8, 2015
- Samsung Electronics Co., Ltd.
- Yukimori Yoshiaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip bonding apparatus and method of forming semicond...
- Patent number 9,082,885
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki Yukimori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL
- Publication number 20240009747
- Publication date Jan 11, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING CONDUCTIVE BALLS USING ELECTROSTATIC CHUCK
- Publication number 20230093905
- Publication date Mar 30, 2023
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MOUNTING CONDUCTIVE BALL
- Publication number 20200144219
- Publication date May 7, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING CONDUCTIVE BALL
- Publication number 20200144220
- Publication date May 7, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID PRESSURE ACTUATOR
- Publication number 20150159681
- Publication date Jun 11, 2015
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUSES AND METHODS THEREOF
- Publication number 20150155210
- Publication date Jun 4, 2015
- Samsung Electronics Co., Ltd.
- Byung Joon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...
- Publication number 20150024551
- Publication date Jan 22, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki YUKIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOGNITION APPARATUS, RECOGNITION METHOD, MOUNTING APPARATUS, AND...
- Publication number 20140160272
- Publication date Jun 12, 2014
- Samsung Electronics Co., Ltd.
- Ueyama SHINJI
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING APPARATUS AND MOUNTING METHOD
- Publication number 20140154838
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Yukimori YOSHIAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF RECOGNIZING AN OBJECT, AND APPARATUS AND ME...
- Publication number 20140141539
- Publication date May 22, 2014
- Samsung Electronics Co., Ltd.
- Ueyama SHINJI
- G01 - MEASURING TESTING

Yoshiaki YUKIMORI

Person

Patents Grantslast 30 patents

Apparatus for mounting conductive ball

Method of mounting conductive ball

Fluid pressure actuator

Semiconductor manufacturing apparatuses comprising bonding heads

Recognition apparatus, recognition method, mounting apparatus, and...

Apparatus and method of recognizing an object, and apparatus and me...

Mounting apparatus and mounting method for flip chip bonding semico...

Semiconductor chip bonding apparatus and method of forming semicond...

Patents Applicationslast 30 patents

HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL

METHOD OF MOUNTING CONDUCTIVE BALLS USING ELECTROSTATIC CHUCK

APPARATUS FOR MOUNTING CONDUCTIVE BALL

METHOD OF MOUNTING CONDUCTIVE BALL

FLUID PRESSURE ACTUATOR

SEMICONDUCTOR MANUFACTURING APPARATUSES AND METHODS THEREOF

SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...

RECOGNITION APPARATUS, RECOGNITION METHOD, MOUNTING APPARATUS, AND...

MOUNTING APPARATUS AND MOUNTING METHOD

APPARATUS AND METHOD OF RECOGNIZING AN OBJECT, AND APPARATUS AND ME...