Yoshie Tarutani

Person

Aizuwakamatsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Terminal material for connectors
- Patent number 11,901,659
- Issue date Feb 13, 2024
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Terminal material for connector
- Patent number 11,761,109
- Issue date Sep 19, 2023
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing high-purity electrolytic copper
- Patent number 11,753,733
- Issue date Sep 12, 2023
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Terminal material for connectors
- Patent number 11,721,923
- Issue date Aug 8, 2023
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anti-corrosion terminal material, anti-corrosion terminal and elect...
- Patent number 11,661,667
- Issue date May 30, 2023
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-purity electrolytic copper
- Patent number 11,453,953
- Issue date Sep 27, 2022
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Tin-plated copper terminal material, terminal, and electric-wire te...
- Patent number 11,264,750
- Issue date Mar 1, 2022
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Terminal material for connectors, terminal, and electric wire termi...
- Patent number 11,211,729
- Issue date Dec 28, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-plated copper terminal material, terminal, and wire terminal pa...
- Patent number 11,088,472
- Issue date Aug 10, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Corrosion-resistant terminal material, corrosion-resistant terminal...
- Patent number 10,910,130
- Issue date Feb 2, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-plated copper terminal material, terminal and electric wire ter...
- Patent number 10,858,750
- Issue date Dec 8, 2020
- Mitsubishi Materials Corporation
- Kenji Kubota
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tinned copper terminal material, terminal, and electrical wire end...
- Patent number 10,801,115
- Issue date Oct 13, 2020
- Mitsubishi Materials Corporation
- Kenji Kubota
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Additive for high-purity copper electrolytic refining and method of...
- Patent number 10,793,956
- Issue date Oct 6, 2020
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for high-purity copper electrolytic refining, method of pr...
- Patent number 10,428,434
- Issue date Oct 1, 2019
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for high-purity copper electrolytic refining and method of...
- Patent number 10,407,785
- Issue date Sep 10, 2019
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for high-purity copper electrolytic refining and method of...
- Patent number 10,358,730
- Issue date Jul 23, 2019
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing tin-plated copper terminal material
- Patent number 10,301,737
- Issue date May 28, 2019
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
TERMINAL MATERIAL FOR CONNECTOR
- Publication number 20230299548
- Publication date Sep 21, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTOR
- Publication number 20230111976
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTORS
- Publication number 20220294140
- Publication date Sep 15, 2022
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ANTI-CORROSION TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...
- Publication number 20220085526
- Publication date Mar 17, 2022
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR TERMINAL MATERIAL AND TERMINAL FOR CONNECTOR
- Publication number 20220069498
- Publication date Mar 3, 2022
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-CORROSION TERMINAL MATERIAL, ANTI-CORROSION TERMINAL AND ELECT...
- Publication number 20210184380
- Publication date Jun 17, 2021
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND WIRE TERMINAL PA...
- Publication number 20200259274
- Publication date Aug 13, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRIC-WIRE TE...
- Publication number 20200203868
- Publication date Jun 25, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING HIGH-PURITY ELECTROLYTIC COPPER
- Publication number 20200181788
- Publication date Jun 11, 2020
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL AND ELECTRIC WIRE TER...
- Publication number 20200173049
- Publication date Jun 4, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH-PURITY ELECTROLYTIC COPPER
- Publication number 20200173048
- Publication date Jun 4, 2020
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CORROSION-RESISTANT TERMINAL MATERIAL, CORROSION-RESISTANT TERMINAL...
- Publication number 20200005963
- Publication date Jan 2, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE TERMI...
- Publication number 20190386415
- Publication date Dec 19, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TINNED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...
- Publication number 20190161866
- Publication date May 30, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING TIN-PLATED COPPER TERMINAL MATERIAL
- Publication number 20180347062
- Publication date Dec 6, 2018
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...
- Publication number 20170283966
- Publication date Oct 5, 2017
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...
- Publication number 20170283967
- Publication date Oct 5, 2017
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING, METHOD OF PR...
- Publication number 20170088963
- Publication date Mar 30, 2017
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...
- Publication number 20170058412
- Publication date Mar 2, 2017
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...
- Publication number 20150056466
- Publication date Feb 26, 2015
- MITSUBISHI MATERIALS CORPORATION
- Naoki Kato
- B32 - LAYERED PRODUCTS
Information Patent Application
TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...
- Publication number 20140287262
- Publication date Sep 25, 2014
- MITSUBISHI MATERIALS CORPORATION
- Naoki Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF REMOVING OXIDE FILM ON SURFACE OF COPPER OR COPPER-BASE A...
- Publication number 20130156631
- Publication date Jun 20, 2013
- MITSUBISHI MATERIALS CORPORATION
- Jyunichi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Yoshie Tarutani

Person

Patents Grantslast 30 patents

Terminal material for connectors

Terminal material for connector

Method for producing high-purity electrolytic copper

Terminal material for connectors

Anti-corrosion terminal material, anti-corrosion terminal and elect...

High-purity electrolytic copper

Tin-plated copper terminal material, terminal, and electric-wire te...

Terminal material for connectors, terminal, and electric wire termi...

Tin-plated copper terminal material, terminal, and wire terminal pa...

Corrosion-resistant terminal material, corrosion-resistant terminal...

Tin-plated copper terminal material, terminal and electric wire ter...

Tinned copper terminal material, terminal, and electrical wire end...

Additive for high-purity copper electrolytic refining and method of...

Additive for high-purity copper electrolytic refining, method of pr...

Additive for high-purity copper electrolytic refining and method of...

Additive for high-purity copper electrolytic refining and method of...

Method of manufacturing tin-plated copper terminal material

Patents Applicationslast 30 patents

TERMINAL MATERIAL FOR CONNECTOR

TERMINAL MATERIAL FOR CONNECTOR

TERMINAL MATERIAL FOR CONNECTORS

ANTI-CORROSION TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...

CONNECTOR TERMINAL MATERIAL AND TERMINAL FOR CONNECTOR

ANTI-CORROSION TERMINAL MATERIAL, ANTI-CORROSION TERMINAL AND ELECT...

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND WIRE TERMINAL PA...

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRIC-WIRE TE...

METHOD FOR PRODUCING HIGH-PURITY ELECTROLYTIC COPPER

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL AND ELECTRIC WIRE TER...

HIGH-PURITY ELECTROLYTIC COPPER

CORROSION-RESISTANT TERMINAL MATERIAL, CORROSION-RESISTANT TERMINAL...

TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE TERMI...

TINNED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...

METHOD OF MANUFACTURING TIN-PLATED COPPER TERMINAL MATERIAL

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING, METHOD OF PR...

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...

TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...

TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...

METHOD OF REMOVING OXIDE FILM ON SURFACE OF COPPER OR COPPER-BASE A...