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Yoshie Yamanaka

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 10,076,808
    • Issue date Sep 18, 2018
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 9,844,837
    • Issue date Dec 19, 2017
    • Senju Metal Industry Co., Ltd.
    • Masato Shimamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder ball
    • Patent number 9,780,055
    • Issue date Oct 3, 2017
    • Senju Metal Industry Co., Ltd.
    • Yoshie Yamanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy, connecting member and a method for its manu...
    • Patent number 9,773,721
    • Issue date Sep 26, 2017
    • Senju Metal Industry Co., Ltd.
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder ball
    • Patent number 9,700,963
    • Issue date Jul 11, 2017
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder ball
    • Patent number 9,527,167
    • Issue date Dec 27, 2016
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder connection structure and solder ball
    • Patent number 8,975,757
    • Issue date Mar 10, 2015
    • Senju Metal Industry Co., Ltd.
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding material for semiconductor devices
    • Patent number 8,896,119
    • Issue date Nov 25, 2014
    • Senju Metal Industry Co., Ltd.
    • Yoshitsugu Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    "Lead-Free Solder Ball"
    • Publication number 20190088611
    • Publication date Mar 21, 2019
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20190076966
    • Publication date Mar 14, 2019
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20180005970
    • Publication date Jan 4, 2018
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20160339543
    • Publication date Nov 24, 2016
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20150221606
    • Publication date Aug 6, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20150037088
    • Publication date Feb 5, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANU...
    • Publication number 20140326490
    • Publication date Nov 6, 2014
    • SENJU METAL INDUSTRY CO., LTD.
    • Shunsaku Yoshikawa
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20140141273
    • Publication date May 22, 2014
    • SENJU METAL INDUSTRY CO., LTD.
    • Masato Shimamura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20140061287
    • Publication date Mar 6, 2014
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Bonding Material for Semiconductor Devices
    • Publication number 20130134591
    • Publication date May 30, 2013
    • Yoshitsugu Sakamoto
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MAN...
    • Publication number 20120199393
    • Publication date Aug 9, 2012
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER CONNECTION STRUCTURE AND SOLDER BALL
    • Publication number 20110115084
    • Publication date May 19, 2011
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR