Yoshifumi Kitayama

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor element having protruded bump electrodes
- Patent number 7,071,090
- Issue date Jul 4, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element having protruded bump electrodes
- Patent number 6,894,387
- Issue date May 17, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for applying sealant to IC having bumps
- Patent number 6,455,099
- Issue date Sep 24, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kouhei Enchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component affixing method and apparatus
- Patent number 6,370,750
- Issue date Apr 16, 2002
- Matsushita Electric Industrial Co., Ltd.
- Nobuya Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for packaging IC chip, and tape-shaped carrier...
- Patent number 6,332,268
- Issue date Dec 25, 2001
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a ball bond using a bonding capillary
- Patent number 6,207,549
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of chip parts
- Patent number 5,791,484
- Issue date Aug 11, 1998
- Matsushita Electric Industrial Co., Ltd.
- Junji Ikeda
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of packaging electronic chip component and method of bonding...
- Patent number 5,744,382
- Issue date Apr 28, 1998
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip component with passivation film and organic protect...
- Patent number 5,646,439
- Issue date Jul 8, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,622,590
- Issue date Apr 22, 1997
- Matsushita Electronics Corporation
- Yoshinobu Kunitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,550,408
- Issue date Aug 27, 1996
- Matsushita Electronics Corporation
- Yoshinobu Kunitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,436,503
- Issue date Jul 25, 1995
- Matsushita Electronics Corporation
- Yoshinobu Kunitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding lead of IC component with electrode
- Patent number 5,240,170
- Issue date Aug 31, 1993
- Matsushita Electric Industrial Co., Ltd.
- Kazuto Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bump formation and its equipment
- Patent number 5,116,228
- Issue date May 26, 1992
- Matsushita Electric Industrial Co., Ltd.
- Akira Kabeshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure of a chip type electronic component
- Patent number 5,012,388
- Issue date Apr 30, 1991
- Matsushita Electric Industrial Co., Ltd.
- Akira Kabeshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of semiconductor device
- Patent number 4,676,864
- Issue date Jun 30, 1987
- Matsushita Electric Industrial Co., Ltd.
- Yukio Maeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor element having protruded bump electrodes
- Publication number 20050146029
- Publication date Jul 7, 2005
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a ball bond using a bonding capillary
- Publication number 20010005054
- Publication date Jun 28, 2001
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Yoshifumi Kitayama

Person

Patents Grantslast 30 patents

Semiconductor element having protruded bump electrodes

Semiconductor element having protruded bump electrodes

Method and device for applying sealant to IC having bumps

Component affixing method and apparatus

Method and apparatus for packaging IC chip, and tape-shaped carrier...

Method of forming a ball bond using a bonding capillary

Assembly of chip parts

Method of packaging electronic chip component and method of bonding...

Electronic chip component with passivation film and organic protect...

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device and method of manufacturing the same

Method for bonding lead of IC component with electrode

Method for bump formation and its equipment

Electrode structure of a chip type electronic component

Bonding method of semiconductor device

Patents Applicationslast 30 patents

Semiconductor element having protruded bump electrodes

Method of forming a ball bond using a bonding capillary