Yoshifumi Miyake

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Hirakata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin molding compound for sealing electronic parts
- Patent number 4,683,253
- Issue date Jul 28, 1987
- Risho Kogyo Co., Ltd.
- Yoshifumi Miyake
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...