Yoshifumi OKA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Mask-integrated surface protective tape
- Patent number 11,707,804
- Issue date Jul 25, 2023
- Furukawa Electric Co., Ltd.
- Hirotoki Yokoi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask-integrated surface protective film
- Patent number 10,916,439
- Issue date Feb 9, 2021
- Furukawa Electric Co., Ltd.
- Hirotoki Yokoi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-fixing tape, method of processing a semiconductor wafer, and...
- Patent number 10,699,933
- Issue date Jun 30, 2020
- Furukawa Electric Co., Ltd.
- Yoshifumi Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of processing a semiconductor wafer, semiconductor chip, and...
- Patent number 10,418,267
- Issue date Sep 17, 2019
- Furukawa Electric Co., Ltd.
- Yoshifumi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor chip, and mask-integrated surface...
- Patent number 10,307,866
- Issue date Jun 4, 2019
- Furukawa Electric Co., Ltd.
- Hirotoki Yokoi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MASK-INTEGRATED SURFACE PROTECTIVE TAPE
- Publication number 20180226359
- Publication date Aug 9, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Hirotoki YOKOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR CHIP, AND MASK-INTEGRATED SURFACE...
- Publication number 20180185964
- Publication date Jul 5, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Hirotoki YOKOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASK-INTEGRATED SURFACE PROTECTIVE FILM
- Publication number 20180158691
- Publication date Jun 7, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Hirotoki YOKOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-FIXING TAPE, METHOD OF PROCESSING A SEMICONDUCTOR WAFER, AND...
- Publication number 20180012788
- Publication date Jan 11, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Yoshifumi OKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP, AND...
- Publication number 20180012787
- Publication date Jan 11, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Yoshifumi OKA
- H01 - BASIC ELECTRIC ELEMENTS