Yoshifumi Tahara

Person

Yamato, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Etching method
- Patent number 6,423,242
- Issue date Jul 23, 2002
- Tokyo Electron Limited
- Masayuki Kojima
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 6,110,287
- Issue date Aug 29, 2000
- Tokyo Electron Limited
- Izumi Arai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing method
- Patent number 5,858,258
- Issue date Jan 12, 1999
- Tokyo Electron Limited
- Hiroshi Kojima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method
- Patent number 5,705,081
- Issue date Jan 6, 1998
- Tokyo Electron Limited
- Koichiro Inazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching film formed on semiconductor wafer
- Patent number 5,698,070
- Issue date Dec 16, 1997
- Tokyo Electron Limited
- Yoshihisa Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 5,571,366
- Issue date Nov 5, 1996
- Tokyo Electron Limited
- Nobuo Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma process system and method
- Patent number 5,494,522
- Issue date Feb 27, 1996
- Tokyo Electron Limited
- Shuji Moriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for generating plasma of uniform flux density
- Patent number 5,449,977
- Issue date Sep 12, 1995
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etching method
- Patent number 5,411,631
- Issue date May 2, 1995
- Tokyo Electron Limited
- Masaru Hori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stage having electrostatic chuck and plasma processing apparatus us...
- Patent number 5,382,311
- Issue date Jan 17, 1995
- Tokyo Electron Limited
- Kenji Ishikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry etching method
- Patent number 5,356,515
- Issue date Oct 18, 1994
- Tokyo Electron Limited
- Yoshifumi Tahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching object to be processed including oxide or nitride...
- Patent number 5,302,236
- Issue date Apr 12, 1994
- Tokyo Electron Limited
- Yoshifumi Tahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of adjusting the temperature of a semiconductor wafer
- Patent number 5,270,266
- Issue date Dec 14, 1993
- Tokyo Electron Limited
- Yoshihisa Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method and apparatus
- Patent number 5,203,958
- Issue date Apr 20, 1993
- Tokyo Electron Limited
- Izumi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 5,164,034
- Issue date Nov 17, 1992
- Tokyo Electron Limited
- Izumi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cooling a plasma electrode system for an etching apparatus
- Patent number 5,155,331
- Issue date Oct 13, 1992
- Tokyo Electron Limited
- Takao Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 5,089,083
- Issue date Feb 18, 1992
- Tokyo Electron Limited
- Hiroshi Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing device
- Patent number 4,978,412
- Issue date Dec 18, 1990
- Tokyo Electron Limited
- Makoto Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling of a plasma electrode system for an etching apparatus
- Patent number 4,963,713
- Issue date Oct 16, 1990
- Tokyo Electron Limited
- Takao Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 4,931,135
- Issue date Jun 5, 1990
- Tokyo Electron Limited
- Takao Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Yoshifumi Tahara

Person

Patents Grantslast 30 patents

Etching method

Plasma processing method and plasma processing apparatus

Plasma processing method

Etching method

Method of etching film formed on semiconductor wafer

Plasma processing apparatus

Plasma process system and method

Apparatus and method for generating plasma of uniform flux density

Dry etching method

Stage having electrostatic chuck and plasma processing apparatus us...

Dry etching method

Method of etching object to be processed including oxide or nitride...

Method of adjusting the temperature of a semiconductor wafer

Processing method and apparatus

Apparatus and method for processing substrate

Method for cooling a plasma electrode system for an etching apparatus

Plasma etching method

Plasma processing device

Cooling of a plasma electrode system for an etching apparatus

Etching method and etching apparatus