Yoshifumi Takada

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Hadano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer wiring board
- Patent number 7,989,708
- Issue date Aug 2, 2011
- Hitachi, Ltd.
- Yoshifumi Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer wiring board
- Patent number 7,326,856
- Issue date Feb 5, 2008
- Hitachi, Ltd.
- Yoshifumi Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface circuit and interface-network system using the same
- Patent number 5,661,416
- Issue date Aug 26, 1997
- Hitachi, Ltd.
- Yoshifumi Takada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bidirectional signal transmission circuit and terminator
- Patent number 5,457,406
- Issue date Oct 10, 1995
- Hitachi, Ltd.
- Yoshifumi Takada
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer wiring board
- Publication number 20080047744
- Publication date Feb 28, 2008
- Hitachi, Ltd
- Yoshifumi Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer wiring board
- Publication number 20050161255
- Publication date Jul 28, 2005
- Hitachi, Ltd
- Yoshifumi Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR