Yoshiharu HIDAKA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate, method for fabricating the same, and metho...
- Patent number 7,393,759
- Issue date Jul 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yoshiharu Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method
- Patent number 7,331,844
- Issue date Feb 19, 2008
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Grant
Cleaning composition for removing resists and method of manufacturi...
- Patent number 7,250,391
- Issue date Jul 31, 2007
- Renesas Technology Corp.
- Itaru Kanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for feeding slurry
- Patent number 7,249,995
- Issue date Jul 31, 2007
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for feeding slurry
- Patent number 7,166,018
- Issue date Jan 23, 2007
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor substrate, method for fabricating the same, and metho...
- Patent number 7,102,206
- Issue date Sep 5, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yoshiharu Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for feeding slurry
- Patent number 7,052,377
- Issue date May 30, 2006
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for feeding slurry
- Patent number 6,790,127
- Issue date Sep 14, 2004
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for feeding slurry
- Patent number 6,585,560
- Issue date Jul 1, 2003
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Grant
Method for wafer polishing and method for polishing-pad dressing
- Patent number 6,428,398
- Issue date Aug 6, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shin Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for feeding slurry
- Patent number 6,319,099
- Issue date Nov 20, 2001
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Grant
Method for wafer polishing and method for polishing pad dressing
- Patent number 6,180,423
- Issue date Jan 30, 2001
- Matsushita Electronics Corporation
- Shin Hashimoto
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20100304554
- Publication date Dec 2, 2010
- Yoshiharu Hidaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20100178763
- Publication date Jul 15, 2010
- Kenji NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20100178764
- Publication date Jul 15, 2010
- Kenji NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20100144146
- Publication date Jun 10, 2010
- Koji UTAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate, method for fabricating the same, and metho...
- Publication number 20060270193
- Publication date Nov 30, 2006
- Matsushita Electric Industries Co., Ltd.
- Yoshiharu Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for feeding slurry
- Publication number 20060199480
- Publication date Sep 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050191853
- Publication date Sep 1, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yoshiharu Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for feeding slurry
- Publication number 20050003745
- Publication date Jan 6, 2005
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus and method for feeding slurry
- Publication number 20040242127
- Publication date Dec 2, 2004
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor substrate, method for fabricating the same, and metho...
- Publication number 20040140536
- Publication date Jul 22, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yoshiharu Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for feeding slurry
- Publication number 20040132386
- Publication date Jul 8, 2004
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Application
Cleaning composition for removing resists and method of manufacturi...
- Publication number 20040106531
- Publication date Jun 3, 2004
- Renesas Technology Corp.
- Itaru Kanno
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Apparatus and method for feeding slurry
- Publication number 20020039878
- Publication date Apr 4, 2002
- Akihiro Tanoue
- B24 - GRINDING POLISHING
Information Patent Application
Method for wafer polishing and method for polishing-pad dressing
- Publication number 20010000490
- Publication date Apr 26, 2001
- Matsushita Electronics Corporation
- Shin Hashimoto
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus and method for feeding slurry
- Publication number 20010000166
- Publication date Apr 5, 2001
- Akihiro Tanoue
- B24 - GRINDING POLISHING

Yoshiharu HIDAKA

Person

Patents Grantslast 30 patents

Semiconductor substrate, method for fabricating the same, and metho...

Polishing method

Cleaning composition for removing resists and method of manufacturi...

Apparatus and method for feeding slurry

Apparatus and method for feeding slurry

Semiconductor substrate, method for fabricating the same, and metho...

Apparatus and method for feeding slurry

Apparatus and method for feeding slurry

Apparatus and method for feeding slurry

Method for wafer polishing and method for polishing-pad dressing

Apparatus and method for feeding slurry

Method for wafer polishing and method for polishing pad dressing

Patents Applicationslast 30 patents

PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Semiconductor substrate, method for fabricating the same, and metho...

Apparatus and method for feeding slurry

Method of manufacturing semiconductor device

Apparatus and method for feeding slurry

Apparatus and method for feeding slurry

Semiconductor substrate, method for fabricating the same, and metho...

Apparatus and method for feeding slurry

Cleaning composition for removing resists and method of manufacturi...

Apparatus and method for feeding slurry

Method for wafer polishing and method for polishing-pad dressing

Apparatus and method for feeding slurry