Yoshiharu HIROSE

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Aichi-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for evaluating solder joint portion
- Patent number 7,658,538
- Issue date Feb 9, 2010
- Aisin Seiki Kabushiki Kaisha
- Hirofumi Koike
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR EVALUATING SOLDER JOINT PORTION
- Publication number 20080240201
- Publication date Oct 2, 2008
- AISIN SEIKI KABUSHIKI KAISHA
- Hirofumi KOIKE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...