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Yoshihiko Miyakawa
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method and apparatus for bonding flexible board
Patent number
7,395,846
Issue date
Jul 8, 2008
TDK Corporation
Yoshihiko Miyakawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Work piece holding apparatus, work piece illumination apparatus and...
Patent number
7,192,150
Issue date
Mar 20, 2007
TDK Corporation
Yoshihiko Miyakawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Work piece holding apparatus, work piece illumination apparatus and...
Publication number
20040240197
Publication date
Dec 2, 2004
TDK Corporation
Yoshihiko Miyakawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and apparatus for bonding flexible board
Publication number
20040238113
Publication date
Dec 2, 2004
TDK Corporation
Yoshihiko Miyakawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR