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Yoshihiko Yagi
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Patents Grants
last 30 patents
Information
Patent Grant
Ingot cutting apparatus, and load detecting device used in ingot cu...
Patent number
10,363,685
Issue date
Jul 30, 2019
TEC GIHAN CO., LTD.
Masayuki Takahashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three-dimensional circuit board
Patent number
8,809,693
Issue date
Aug 19, 2014
Panasonic Corporation
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conductive bump, method for producing the same, and electronic comp...
Patent number
8,575,751
Issue date
Nov 5, 2013
Panasonic Corporation
Daisuke Sakurai
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Substrate joining member and three-dimensional structure using the...
Patent number
8,208,270
Issue date
Jun 26, 2012
Panasonic Corporation
Masato Mori
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Relay substrate, method for manufacturing the relay substrate and t...
Patent number
8,159,829
Issue date
Apr 17, 2012
Panasonic Corporation
Masato Mori
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three-dimensional circuit board and its manufacturing method
Patent number
8,134,081
Issue date
Mar 13, 2012
Panasonic Corporation
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component mounting structure and method for manufacturin...
Patent number
8,120,188
Issue date
Feb 21, 2012
Panasonic Corporation
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing an electronic part mounting structure
Patent number
8,119,449
Issue date
Feb 21, 2012
Panasonic Corporation
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing an electrode and electrode component mount...
Patent number
8,033,016
Issue date
Oct 11, 2011
Panasonic Corporation
Kunio Hibino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnect substrate and electronic circuit mounted structure
Patent number
8,018,731
Issue date
Sep 13, 2011
Panasonic Corporation
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conductive bump, method for manufacturing the conductive bump, semi...
Patent number
7,928,566
Issue date
Apr 19, 2011
Panasonic Corporation
Yoshihiko Yagi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnecting board and three-dimensional wiring structure using it
Patent number
7,845,954
Issue date
Dec 7, 2010
Panasonic Corporation
Yoshihiro Tomura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate connecting member and connecting structure
Patent number
7,762,819
Issue date
Jul 27, 2010
Panasonic Corporation
Masato Mori
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding method and apparatus
Patent number
7,659,148
Issue date
Feb 9, 2010
Panasonic Corporation
Tatsuo Sasaoka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stereoscopic electronic circuit device, and relay board and relay f...
Patent number
7,613,010
Issue date
Nov 3, 2009
Panasonic Corporation
Masahiro Ono
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor element having protruded bump electrodes
Patent number
7,071,090
Issue date
Jul 4, 2006
Matsushita Electric Industrial Co., Ltd.
Kazushi Higashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Card type recording medium and production method therefor
Patent number
6,985,363
Issue date
Jan 10, 2006
Matsushita Electric Industrial Co., Ltd.
Yoshihiko Yagi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method and apparatus for manufacturing semiconductor device
Patent number
6,966,964
Issue date
Nov 22, 2005
Matsushita Electric Industrial Co., Ltd.
Koujiro Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor element having protruded bump electrodes
Patent number
6,894,387
Issue date
May 17, 2005
Matsushita Electric Industrial Co., Ltd.
Kazushi Higashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip—mounting board
Patent number
6,787,922
Issue date
Sep 7, 2004
Matsushita Electric Industrial Co., Ltd.
Hiroyuki Otani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for mounting semiconductor element to circuit board
Patent number
6,651,320
Issue date
Nov 25, 2003
Matsushita Electric Industrial Co., Ltd.
Yoshihiko Yagi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for mounting a semiconductor chip to a semiconductor chip-mo...
Patent number
6,566,165
Issue date
May 20, 2003
Matsushita Electric Industrial Co., Ltd.
Hiroyuki Otani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a ball bond using a bonding capillary
Patent number
6,207,549
Issue date
Mar 27, 2001
Matsushita Electric Industrial Co., Ltd.
Kazushi Higashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip-mounting board providing a high bonding strength...
Patent number
6,061,248
Issue date
May 9, 2000
Matsushita Electric Industrial Co., Ltd.
Hiroyuki Otani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
5,686,353
Issue date
Nov 11, 1997
Matsushita Electric Industrial Co., Ltd.
Yoshihiko Yagi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INGOT CUTTING APPARATUS, AND LOAD DETECTING DEVICE USED IN INGOT CU...
Publication number
20180085969
Publication date
Mar 29, 2018
Tec Gihan Co., Ltd.
Masayuki Takahashi
B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information
Patent Application
THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD
Publication number
20120125676
Publication date
May 24, 2012
PANASONIC CORPORATION
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURIN...
Publication number
20100052189
Publication date
Mar 4, 2010
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMI...
Publication number
20100029044
Publication date
Feb 4, 2010
Yoshihiko Yagi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY F...
Publication number
20100008056
Publication date
Jan 14, 2010
PANASONIC CORPORATION
Masahiro ONO
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
RELAY SUBSTRATE, METHOD FOR MANUFACTURING THE RELAY SUBSTRATE AND T...
Publication number
20090321122
Publication date
Dec 31, 2009
Masato Mori
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMP...
Publication number
20090315178
Publication date
Dec 24, 2009
Daisuke Sakurai
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
INTERCONNECT SUBSTRATE AND ELECTRONIC CIRCUIT MOUNTED STRUCTURE
Publication number
20090268423
Publication date
Oct 29, 2009
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD
Publication number
20090266582
Publication date
Oct 29, 2009
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Substrate Connecting Member and Connecting Structure
Publication number
20090215287
Publication date
Aug 27, 2009
Masato Mori
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC PART MOUNTING STRUCTURE AND ITS MANUFACTURING METHOD
Publication number
20090026634
Publication date
Jan 29, 2009
Daisuke Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Substrate Joining Member and Three-Dimensional Structure Using the...
Publication number
20090009979
Publication date
Jan 8, 2009
Masato Mori
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Interconnecting Board and Three-Dimensional Wiring Structure Using it
Publication number
20080139013
Publication date
Jun 12, 2008
Matsushita Electric Industrial Co., Ltd.
Yoshihiro Tomura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Protruding Electrode for Connecting Electronic Component, Electroni...
Publication number
20080135283
Publication date
Jun 12, 2008
Kunio Hibino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bonding method and apparatus
Publication number
20070193682
Publication date
Aug 23, 2007
Matsushita Electric Industrial Co., Ltd.
Tatsuo Sasaoka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Stereoscopic electronic circuit device, and relay board and relay f...
Publication number
20050168961
Publication date
Aug 4, 2005
Masahiro Ono
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Semiconductor element having protruded bump electrodes
Publication number
20050146029
Publication date
Jul 7, 2005
Kazushi Higashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Card type recording medium and production method therefor
Publication number
20040104469
Publication date
Jun 3, 2004
Yoshihiko Yagi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Method and apparatus for manufacturing semiconductor device
Publication number
20030138993
Publication date
Jul 24, 2003
Matsushita Elec. Ind. Co., Ltd.
Koujiro Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip-mounting board
Publication number
20030116863
Publication date
Jun 26, 2003
Hiroyuki Otani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a ball bond using a bonding capillary
Publication number
20010005054
Publication date
Jun 28, 2001
Kazushi Higashi
H01 - BASIC ELECTRIC ELEMENTS