Yoshihiro Ishida

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Process for manufacturing semiconductor package and circuit board a...
- Patent number 6,365,438
- Issue date Apr 2, 2002
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device, and main board for circuit boards
- Patent number 6,324,068
- Issue date Nov 27, 2001
- Citizen Watch Co., Ltd.
- Kiyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacture electronic component device
- Patent number 6,219,912
- Issue date Apr 24, 2001
- Citizen Watch Co., Ltd.
- Kiyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 6,214,649
- Issue date Apr 10, 2001
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,177,731
- Issue date Jan 23, 2001
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bump of semiconductor device
- Patent number 6,066,551
- Issue date May 23, 2000
- Citizen Watch Co., Ltd.
- Tetsuo Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,739,588
- Issue date Apr 14, 1998
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulated semiconductor device
- Patent number 5,289,039
- Issue date Feb 22, 1994
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulated pin grid array and method of manufacturing the same
- Patent number 5,233,225
- Issue date Aug 3, 1993
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a resin encapsulated pin grid array with integral...
- Patent number 5,179,039
- Issue date Jan 12, 1993
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a resin encapsulated pin grid array with integral...
- Patent number 5,108,955
- Issue date Apr 28, 1992
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package
- Patent number 4,942,453
- Issue date Jul 17, 1990
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC-packaged device
- Patent number 4,868,634
- Issue date Sep 19, 1989
- Citizen Watch Co., Ltd.
- Yoshihiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS

Yoshihiro Ishida

Person

Patents Grantslast 30 patents

Process for manufacturing semiconductor package and circuit board a...

Electronic component device, and main board for circuit boards

Method for manufacture electronic component device

Integrated circuit package

Semiconductor package

Method for forming bump of semiconductor device

Semiconductor device

Resin encapsulated semiconductor device

Resin encapsulated pin grid array and method of manufacturing the same

Method of making a resin encapsulated pin grid array with integral...

Method of making a resin encapsulated pin grid array with integral...

IC package

IC-packaged device