Yoshihiro Kashiba

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device test probe
- Patent number 7,276,923
- Issue date Oct 2, 2007
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device test probe
- Patent number 7,274,195
- Issue date Sep 25, 2007
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Test socket, method of manufacturing the test socket, test method u...
- Patent number 7,112,976
- Issue date Sep 26, 2006
- Misubishi Denki Kabushiki Kaisha
- Yasushi Tokumo
- G01 - MEASURING TESTING
Information Patent Grant
Socket for testing a semiconductor device and a connecting sheet us...
- Patent number 6,989,681
- Issue date Jan 24, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Shigeki Maekawa
- G01 - MEASURING TESTING
Information Patent Grant
Power semiconductor device
- Patent number 6,979,843
- Issue date Dec 27, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probe for semiconductor devices, method of manufacturing of th...
- Patent number 6,888,344
- Issue date May 3, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Shigeki Maekawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card, and testing apparatus having the same
- Patent number 6,885,204
- Issue date Apr 26, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Vehicle AC generator with rectifier diode package disposed between...
- Patent number 6,882,069
- Issue date Apr 19, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Toshiaki Kashihara
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 6,867,484
- Issue date Mar 15, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test socket, method of manufacturing the test socket, test method u...
- Patent number 6,794,890
- Issue date Sep 21, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Yasushi Tokumo
- G01 - MEASURING TESTING
Information Patent Grant
Member for removing foreign matter adhering to probe tip and method...
- Patent number 6,741,086
- Issue date May 25, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Shigeki Maekawa
- B08 - CLEANING
Information Patent Grant
Probe card, and testing apparatus having the same
- Patent number 6,667,626
- Issue date Dec 23, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Test probe for semiconductor devices, method of manufacturing of th...
- Patent number 6,646,455
- Issue date Nov 11, 2003
- Mitsubishi Denki Kabsuhiki Kaisha
- Shigeki Maekawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device test probe having improved tip portion and man...
- Patent number 6,633,176
- Issue date Oct 14, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Probe card for testing semiconductor integrated circuit and method...
- Patent number 6,628,127
- Issue date Sep 30, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for manufacturing liquid crystal panel and method thereof
- Patent number 6,461,465
- Issue date Oct 8, 2002
- Advanced Display Inc.
- Masahiko Tada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for manufacturing liquid crystal panel and method thereof
- Patent number 6,190,488
- Issue date Feb 20, 2001
- Advanced Display Inc.
- Masahiko Tada
- B32 - LAYERED PRODUCTS
Information Patent Grant
High-frequency circuit device and manufacturing method thereof
- Patent number 6,118,172
- Issue date Sep 12, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Masao Yamawaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly for a semiconductor device
- Patent number 5,637,917
- Issue date Jun 10, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, junctioning method, junction material, and semicon...
- Patent number 5,609,287
- Issue date Mar 11, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Goro Izuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-metal composite substrate and method for producing the same
- Patent number 5,251,803
- Issue date Oct 12, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Kashiba
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic-metal composite substrate
- Patent number 5,153,077
- Issue date Oct 6, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Kashiba
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device test probe
- Publication number 20060038575
- Publication date Feb 23, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE TEST PROBE HAVING IMPROVED TIP PORTION
- Publication number 20050189955
- Publication date Sep 1, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Application
Socket for testing a semiconductor device and a connecting sheet us...
- Publication number 20050145842
- Publication date Jul 7, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Shigeki Maekawa
- G01 - MEASURING TESTING
Information Patent Application
Test socket, method of manufacturing the test socket, test method u...
- Publication number 20040209491
- Publication date Oct 21, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Yasushi Tokumo
- G01 - MEASURING TESTING
Information Patent Application
Socket for testing a semiconductor device and a connecting sheet us...
- Publication number 20040046581
- Publication date Mar 11, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Shigeki Maekawa
- G01 - MEASURING TESTING
Information Patent Application
Probe card, and testing apparatus having the same
- Publication number 20040046580
- Publication date Mar 11, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Application
Power semiconductor device
- Publication number 20030213979
- Publication date Nov 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030197255
- Publication date Oct 23, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Probe card, and testing apparatus having the same
- Publication number 20030160624
- Publication date Aug 28, 2003
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Application
Test probe for semiconductor devices, method of manufacturing of th...
- Publication number 20030090280
- Publication date May 15, 2003
- SHIGEKI MAEKAWA
- G01 - MEASURING TESTING
Information Patent Application
Member for removing foreign matter adhering to probe tip and method...
- Publication number 20020190737
- Publication date Dec 19, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Shigeki Maekawa
- G01 - MEASURING TESTING
Information Patent Application
TEST PROBE FOR SEMICONDUCTOR DEVICES, METHOD OF MANUFACTURING OF TH...
- Publication number 20020097060
- Publication date Jul 25, 2002
- SHIGEKI MAEKAWA
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device test probe, manufacturing method therefor and...
- Publication number 20010046715
- Publication date Nov 29, 2001
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Application
Apparatus for manufacturing liquid crystal panel and method thereof
- Publication number 20010018948
- Publication date Sep 6, 2001
- ADVANCED DISPLAY INC.
- Masahiko Tada
- B32 - LAYERED PRODUCTS
Information Patent Application
Probe card for testing semiconductor integrated circuit and method...
- Publication number 20010015650
- Publication date Aug 23, 2001
- Megumi Takemoto
- G01 - MEASURING TESTING

Yoshihiro Kashiba

Person

Patents Grantslast 30 patents

Semiconductor device test probe

Semiconductor device test probe

Test socket, method of manufacturing the test socket, test method u...

Socket for testing a semiconductor device and a connecting sheet us...

Power semiconductor device

Test probe for semiconductor devices, method of manufacturing of th...

Probe card, and testing apparatus having the same

Vehicle AC generator with rectifier diode package disposed between...

Semiconductor device

Test socket, method of manufacturing the test socket, test method u...

Member for removing foreign matter adhering to probe tip and method...

Probe card, and testing apparatus having the same

Test probe for semiconductor devices, method of manufacturing of th...

Semiconductor device test probe having improved tip portion and man...

Probe card for testing semiconductor integrated circuit and method...

Apparatus for manufacturing liquid crystal panel and method thereof

Apparatus for manufacturing liquid crystal panel and method thereof

High-frequency circuit device and manufacturing method thereof

Lead frame assembly for a semiconductor device

Solder material, junctioning method, junction material, and semicon...

Ceramic-metal composite substrate and method for producing the same

Ceramic-metal composite substrate

Patents Applicationslast 30 patents

Semiconductor device test probe

SEMICONDUCTOR DEVICE TEST PROBE HAVING IMPROVED TIP PORTION

Socket for testing a semiconductor device and a connecting sheet us...

Test socket, method of manufacturing the test socket, test method u...

Socket for testing a semiconductor device and a connecting sheet us...

Probe card, and testing apparatus having the same

Power semiconductor device

Semiconductor device

Probe card, and testing apparatus having the same

Test probe for semiconductor devices, method of manufacturing of th...

Member for removing foreign matter adhering to probe tip and method...

TEST PROBE FOR SEMICONDUCTOR DEVICES, METHOD OF MANUFACTURING OF TH...

Semiconductor device test probe, manufacturing method therefor and...

Apparatus for manufacturing liquid crystal panel and method thereof

Probe card for testing semiconductor integrated circuit and method...