TREA

Yoshihiro KITA

Follow

Person

  • Nagano-shi, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Folded substrate for stacked integrated circuit devices
    • Patent number 11,309,224
    • Issue date Apr 19, 2022
    • Shinko Electric Industries Co., Ltd.
    • Yasuyoshi Horikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate
    • Patent number 11,019,722
    • Issue date May 25, 2021
    • Shinko Electric Industries Co., Ltd.
    • Kenichi Mori
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Interconnect substrate
    • Patent number 10,510,649
    • Issue date Dec 17, 2019
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro Kita
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20190394870
    • Publication date Dec 26, 2019
    • Shinko Electric Industries Co., Ltd.
    • Kenichi Mori
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT SUBSTRATE
    • Publication number 20190371717
    • Publication date Dec 5, 2019
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro KITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20190198411
    • Publication date Jun 27, 2019
    • Shinko Electric Industries Co., Ltd.
    • Yasuyoshi HORIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS