Yoshihiro Kitamura

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor device allowing smooth bump sur...
- Patent number 8,765,594
- Issue date Jul 1, 2014
- Yoshihiro Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including trench gate transistor and method of...
- Patent number 7,821,060
- Issue date Oct 26, 2010
- Elpida Memory, Inc.
- Yoshihiro Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and oxidization method...
- Patent number 7,163,871
- Issue date Jan 16, 2007
- Elpida Memory, Inc.
- Taishi Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge converter provided in an ion implantation apparatus
- Patent number 5,670,785
- Issue date Sep 23, 1997
- NEC Corporation
- Yoshihiro Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a bump by bonding a ball on an electrode of an e...
- Patent number 5,246,159
- Issue date Sep 21, 1993
- NEC Corporation
- Yoshihiro Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE ALLOWING SMOOTH BUMP SUR...
- Publication number 20110318918
- Publication date Dec 29, 2011
- Elpida Memory, Inc.
- Yoshihiro KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including trench gate transistor and method of...
- Publication number 20090020809
- Publication date Jan 22, 2009
- Elpida Memory, Inc.
- Yoshihiro Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device and oxidization method...
- Publication number 20040214404
- Publication date Oct 28, 2004
- Taishi Kubota
- H01 - BASIC ELECTRIC ELEMENTS