Yoshihiro Mizukami

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Chikusei-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin molding material for sealing use and semiconductor device
- Patent number 7,397,139
- Issue date Jul 8, 2008
- Hitachi Chemical Co., Ltd.
- Ryoichi Ikezawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Epoxy resin molding material for sealing use and semiconductor device
- Publication number 20060214153
- Publication date Sep 28, 2006
- Ryoichi Ikezawa
- H01 - BASIC ELECTRIC ELEMENTS