Yoshihiro Nakata

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
High-frequency circuit board and antenna module
- Patent number 12,193,151
- Issue date Jan 7, 2025
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and electronic apparatus
- Patent number 12,185,502
- Issue date Dec 31, 2024
- Fujitsu Limited
- Shinya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with built-in electronic components and electronic device
- Patent number 12,148,724
- Issue date Nov 19, 2024
- Fujitsu Limited
- Yukiko Oshikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling member between a heat sink and substrate
- Patent number 11,430,712
- Issue date Aug 30, 2022
- Fujitsu Limited
- Junya Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin board, method of manufacturing resin board, circuit board, an...
- Patent number 10,483,195
- Issue date Nov 19, 2019
- Fujitsu Limited
- Yasushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including insulating films with different mois...
- Patent number 9,496,222
- Issue date Nov 15, 2016
- Fujitsu Limited
- Junichi Kon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist composition and method for forming pattern
- Patent number 9,354,517
- Issue date May 31, 2016
- Fujitsu Limited
- Junichi Kon
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Interconnection structure and method of forming the same
- Patent number 9,263,326
- Issue date Feb 16, 2016
- Fujitsu Limited
- Tsuyoshi Kanki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an interconnection structure
- Patent number 8,956,967
- Issue date Feb 17, 2015
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and manufacturing method thereof, and electronic a...
- Patent number 8,872,040
- Issue date Oct 28, 2014
- Fujitsu Limited
- Tsuyoshi Kanki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacture method
- Patent number 8,791,561
- Issue date Jul 29, 2014
- Fujitsu Limited
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Agent for post-etch treatment of silicon dielectric film, method of...
- Patent number 8,716,209
- Issue date May 6, 2014
- Fujitsu Limited
- Yasushi Kobayashi
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Insulating film material, multilayer wiring board and production me...
- Patent number 8,580,907
- Issue date Nov 12, 2013
- Fujitsu Limited
- Yasushi Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,461,041
- Issue date Jun 11, 2013
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wet etching while forming interconnect trench in insulat...
- Patent number 8,449,787
- Issue date May 28, 2013
- Fujitsu Limited
- Tadahiro Imada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing metal, multilayer interconnection structure and...
- Patent number 8,440,577
- Issue date May 14, 2013
- Fujitsu Semiconductor Limited
- Yoshihiro Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing silicic coating, silicic coating and semicond...
- Patent number 8,431,464
- Issue date Apr 30, 2013
- Fujitsu Limited
- Yasushi Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and its manufacture method
- Patent number 8,399,295
- Issue date Mar 19, 2013
- Fujitsu Limited
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection substrate having first and second insulating films...
- Patent number 8,390,099
- Issue date Mar 5, 2013
- Fujitsu Limited
- Shirou Ozaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,378,489
- Issue date Feb 19, 2013
- Fujitsu Limited
- Shiro Ozaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silicon compound, ultraviolet absorbent, method for manufacturing m...
- Patent number 8,207,059
- Issue date Jun 26, 2012
- Fujitsu Limited
- Shirou Ozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Interfacial roughness reducing film, wiring layer, semiconductor de...
- Patent number 8,164,166
- Issue date Apr 24, 2012
- Fujitsu Limited
- Tadahiro Imada
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Silica film forming material, silica film and method of manufacturi...
- Patent number 8,124,239
- Issue date Feb 28, 2012
- Fujitsu Limited
- Yoshihiro Nakata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Surface-hydrophobicized film, material for formation of surface-hyd...
- Patent number 8,089,138
- Issue date Jan 3, 2012
- Fujitsu Limited
- Tadahiro Imada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Coating liquid for forming amorphous silica-based coating film with...
- Patent number 8,062,414
- Issue date Nov 22, 2011
- JGC Catalysts and Chemicals Ltd.
- Akira Nakashima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composition for forming insulating film and method for fabricating...
- Patent number 7,985,700
- Issue date Jul 26, 2011
- Fujitsu Limited
- Shirou Ozaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Roughness reducing film at interface, materials for forming roughne...
- Patent number 7,928,536
- Issue date Apr 19, 2011
- Fujitsu Limited
- Tadahiro Imada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating film material, multilayer interconnection structure, met...
- Patent number 7,875,981
- Issue date Jan 25, 2011
- Fujitsu Limited
- Yasushi Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Material for forming exposure light-blocking film, multilayer inter...
- Patent number 7,830,012
- Issue date Nov 9, 2010
- Fujitsu Limited
- Shirou Ozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Material for forming adhesion reinforcing layer, adhesion reinforci...
- Patent number 7,830,013
- Issue date Nov 9, 2010
- Fujitsu Limited
- Junichi Kon
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH ANTENNA
- Publication number 20240088083
- Publication date Mar 14, 2024
- Fujitsu Limited
- Junya IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT BOARD AND ANTENNA MODULE
- Publication number 20230354507
- Publication date Nov 2, 2023
- Fujitsu Limited
- Shirou OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND ELECTRONIC APPARATUS
- Publication number 20230309267
- Publication date Sep 28, 2023
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BUILT-IN ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE
- Publication number 20230044252
- Publication date Feb 9, 2023
- Fujitsu Limited
- Yukiko Oshikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210287961
- Publication date Sep 16, 2021
- Fujitsu Limited
- JUNYA IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC DEVICE
- Publication number 20210013178
- Publication date Jan 14, 2021
- Fujitsu Limited
- TERU NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR A...
- Publication number 20200395336
- Publication date Dec 17, 2020
- Fujitsu Limited
- Ayumi Okano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20200168563
- Publication date May 28, 2020
- FUJITSU LIMITED
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT...
- Publication number 20190312122
- Publication date Oct 10, 2019
- FUJITSU LIMITED
- Masaru Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN BOARD, METHOD OF MANUFACTURING RESIN BOARD, CIRCUIT BOARD, AN...
- Publication number 20170365545
- Publication date Dec 21, 2017
- Fujitsu Limited
- Yasushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160381795
- Publication date Dec 29, 2016
- Fujitsu Limited
- Junya Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20150243555
- Publication date Aug 27, 2015
- Fujitsu Limited
- Tsuyoshi Kanki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20150135472
- Publication date May 21, 2015
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST COMPOSITION AND METHOD FOR FORMING PATTERN
- Publication number 20140272706
- Publication date Sep 18, 2014
- Fujitsu Limited
- Junichi Kon
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20140264826
- Publication date Sep 18, 2014
- Fujitsu Limited
- Junichi Kon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR WET ETCHING WHILE FORMING INTERCONNECT TRENCH IN INSU...
- Publication number 20130233489
- Publication date Sep 12, 2013
- FUJITSU LIMITED
- Tadahiro IMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD
- Publication number 20130154102
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC A...
- Publication number 20130048358
- Publication date Feb 28, 2013
- Fujitsu Limited
- Tsuyoshi KANKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METHOD OF INTERCONNECTION STRUCTURE, FABRICATION METHOD OF...
- Publication number 20120325920
- Publication date Dec 27, 2012
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20120181070
- Publication date Jul 19, 2012
- Fujitsu Limited
- Tsuyoshi Kanki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110223766
- Publication date Sep 15, 2011
- Fujitsu Limited
- Yasushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD
- Publication number 20110187002
- Publication date Aug 4, 2011
- FUJITSU LIMITED
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110068471
- Publication date Mar 24, 2011
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION SUBSTRATE, SEMICONDUCTOR DEVICE, AND PRODUCTION MET...
- Publication number 20100320618
- Publication date Dec 23, 2010
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A INTERLAYER INSULATION FILM WITH LOW D...
- Publication number 20100210106
- Publication date Aug 19, 2010
- Fujitsu Limited
- Shoichi Suda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR FORMING EXPOSURE LIGHT-BLOCKING FILM, MULTILAYER INTER...
- Publication number 20100176496
- Publication date Jul 15, 2010
- Fujitsu Limited
- Shirou Ozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURI...
- Publication number 20100155121
- Publication date Jun 24, 2010
- Fujitsu Limited
- Yoshihiro Nakata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INSULATING FILM MATERIAL, MULTILAYER WIRING BOARD AND PRODUCTION ME...
- Publication number 20100140807
- Publication date Jun 10, 2010
- Fujitsu Limited
- Yasushi KOBAYASHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR PRODUCING SILICIC COATING, SILICIC COATING AND SEMICOND...
- Publication number 20100133692
- Publication date Jun 3, 2010
- Fujitsu Limited
- Yasushi Kobayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF...
- Publication number 20100007031
- Publication date Jan 14, 2010
- Fujitsu Limited
- Yasushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Yoshihiro Nakata

Person

Patents Grantslast 30 patents

High-frequency circuit board and antenna module

Semiconductor apparatus and electronic apparatus

Package with built-in electronic components and electronic device

Filling member between a heat sink and substrate

Resin board, method of manufacturing resin board, circuit board, an...

Semiconductor device including insulating films with different mois...

Resist composition and method for forming pattern

Interconnection structure and method of forming the same

Method of forming an interconnection structure

Wiring structure and manufacturing method thereof, and electronic a...

Semiconductor device and its manufacture method

Agent for post-etch treatment of silicon dielectric film, method of...

Insulating film material, multilayer wiring board and production me...

Semiconductor device and method of manufacturing semiconductor device

Method for wet etching while forming interconnect trench in insulat...

Method for reducing metal, multilayer interconnection structure and...

Process for producing silicic coating, silicic coating and semicond...

Semiconductor device and its manufacture method

Interconnection substrate having first and second insulating films...

Semiconductor device and manufacturing method therefor

Silicon compound, ultraviolet absorbent, method for manufacturing m...

Interfacial roughness reducing film, wiring layer, semiconductor de...

Silica film forming material, silica film and method of manufacturi...

Surface-hydrophobicized film, material for formation of surface-hyd...

Coating liquid for forming amorphous silica-based coating film with...

Composition for forming insulating film and method for fabricating...

Roughness reducing film at interface, materials for forming roughne...

Insulating film material, multilayer interconnection structure, met...

Material for forming exposure light-blocking film, multilayer inter...

Material for forming adhesion reinforcing layer, adhesion reinforci...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH ANTENNA

HIGH-FREQUENCY CIRCUIT BOARD AND ANTENNA MODULE

SEMICONDUCTOR APPARATUS AND ELECTRONIC APPARATUS

PACKAGE WITH BUILT-IN ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

ELECTRONIC MODULE AND ELECTRONIC DEVICE

SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR A...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT...

RESIN BOARD, METHOD OF MANUFACTURING RESIN BOARD, CIRCUIT BOARD, AN...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTERCONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

SUBSTRATE PROCESSING APPARATUS

RESIST COMPOSITION AND METHOD FOR FORMING PATTERN

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

APPARATUS FOR WET ETCHING WHILE FORMING INTERCONNECT TRENCH IN INSU...

SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD

WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC A...

FORMING METHOD OF INTERCONNECTION STRUCTURE, FABRICATION METHOD OF...

INTERCONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTERCONNECTION SUBSTRATE, SEMICONDUCTOR DEVICE, AND PRODUCTION MET...

SEMICONDUCTOR DEVICE HAVING A INTERLAYER INSULATION FILM WITH LOW D...

MATERIAL FOR FORMING EXPOSURE LIGHT-BLOCKING FILM, MULTILAYER INTER...

SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURI...

INSULATING FILM MATERIAL, MULTILAYER WIRING BOARD AND PRODUCTION ME...

PROCESS FOR PRODUCING SILICIC COATING, SILICIC COATING AND SEMICOND...

AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF...