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Yoshihiro Nomura
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Ichihara, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
Patent number
7,560,307
Issue date
Jul 14, 2009
Hitachi Chemical Company, Ltd.
Yasuhiro Yano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Punched adhesive tape for semiconductor, method of manufacturing le...
Patent number
7,449,076
Issue date
Nov 11, 2008
Hitachi Chemical Company, Ltd.
Yoshiyuki Tanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Punched adhesive tape for semiconductor, method of manufacturing le...
Patent number
7,273,654
Issue date
Sep 25, 2007
Hitachi Chemical Company, Ltd.
Yoshiyuki Tanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
Patent number
7,061,081
Issue date
Jun 13, 2006
Hitachi Chemical Co., Ltd.
Yasuhiro Yano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, substrate for mounting semiconductor chip, pr...
Patent number
6,621,170
Issue date
Sep 16, 2003
Hitachi Chemical Company, Ltd.
Kazunori Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing a lead frame with composite film attached, and...
Patent number
6,558,500
Issue date
May 6, 2003
Hitachi Chemical Company, Ltd.
Hidekazu Matsuura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Punched adhesive tape for semiconductor, method of manufacturing le...
Patent number
6,523,446
Issue date
Feb 25, 2003
Hitachi Chemical Company, Ltd.
Yoshiyuki Tanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive film of quinoline polymer and bismaleimide
Patent number
6,462,148
Issue date
Oct 8, 2002
Hitachi Chemical Co., Ltd.
Masahiro Suzuki
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Insulating adhesive for electronic parts, and lead frame and semico...
Patent number
6,445,076
Issue date
Sep 3, 2002
Hitachi Chemical Company, Ltd.
Takehiro Shimizu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Method of producing a lead frame with composite film attached, and...
Patent number
6,302,991
Issue date
Oct 16, 2001
Hitachi Chemical Co., Ltd.
Hidekazu Matsuura
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Semiconductor device, semiconductor chip mounting substrate, method...
Patent number
6,265,782
Issue date
Jul 24, 2001
Hitachi Chemical Co., Ltd.
Kazunori Yamamoto
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Composite film and lead frame with composite film attached
Patent number
5,998,020
Issue date
Dec 7, 1999
Hitachi Chemical Co., Ltd.
Hidekazu Matsuura
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Hot-melt adhesive and its use in polyimide film and printed circuit...
Patent number
5,212,279
Issue date
May 18, 1993
Hitachi Chemical Co., Ltd.
Yoshihiro Nomura
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Impact modifier, thermoplastic resin composition using the same and...
Patent number
5,180,786
Issue date
Jan 19, 1993
Hitachi Chemical Company, Ltd.
Susumu Era
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Solvent-soluble polyimide and production thereof
Patent number
4,954,612
Issue date
Sep 4, 1990
Hitachi Chemical Co., Ltd.
Yoshihiro Nomura
C07 - ORGANIC CHEMISTRY
Patents Applications
last 30 patents
Information
Patent Application
PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING L...
Publication number
20090022893
Publication date
Jan 22, 2009
Yoshiyuki Tanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
Publication number
20060180908
Publication date
Aug 17, 2006
Yasuhiro Yano
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
Punched adhesive tape for semiconductor, method of manufacturing le...
Publication number
20060027312
Publication date
Feb 9, 2006
Yoshiyuki Tanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
Publication number
20030082925
Publication date
May 1, 2003
Yasuhiro Yano
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
Punched adhesive tape for semiconductor, method of manufacturing le...
Publication number
20030021990
Publication date
Jan 30, 2003
Yoshiyuki Tanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN COMPOSITION AND ADHESIVE FILM
Publication number
20020151659
Publication date
Oct 17, 2002
MASAHIRO SUZUKI
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Method of producing a lead frame with composite film attached, and...
Publication number
20020007905
Publication date
Jan 24, 2002
Hidekazu Matsuura
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Semiconductor device, substrate for mounting semiconductor chip, pr...
Publication number
20010022404
Publication date
Sep 20, 2001
Hitachi Chemical Company Ltd.
Kazunori Yamamoto
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...