Yoshihiro Ohkura

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Iwata-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for inspection of wafer and semiconductor device
- Patent number 8,224,062
- Issue date Jul 17, 2012
- Yamaha Corporation
- Yoshihiro Ohkura
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor element and wafer level chip size package therefor
- Patent number 7,830,011
- Issue date Nov 9, 2010
- Yamaha Corporation
- Kentaro Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test chip socket and method for testing a chip
- Patent number 7,642,799
- Issue date Jan 5, 2010
- Yamaha Corporation
- Yoshihiro Ohkura
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for testing a semiconductor device
- Patent number 7,626,410
- Issue date Dec 1, 2009
- Yamaha Corporation
- Yoshihiro Ohkura
- G01 - MEASURING TESTING
Information Patent Grant
Surface mount chip package
- Patent number 7,262,512
- Issue date Aug 28, 2007
- Yamaha Corporation
- Yoshihiro Ohkura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding chip size package therefor
- Patent number 7,230,326
- Issue date Jun 12, 2007
- Yamaha Corporation
- Yoshihiro Ohkura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE
- Publication number 20080094094
- Publication date Apr 24, 2008
- Yamaha Corporation
- YOSHIHIRO OHKURA
- G01 - MEASURING TESTING
Information Patent Application
TEST CHIP SOCKET
- Publication number 20080054925
- Publication date Mar 6, 2008
- Yamaha Corporation
- YOSHIHIRO Ohkura
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR INSPECTION OF WAFER AND SEMICONDUCTOR DEVICE
- Publication number 20080037859
- Publication date Feb 14, 2008
- Yamaha Corporation
- YOSHIHIRO OHKURA
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and wire bonding chip size package therefor
- Publication number 20060049507
- Publication date Mar 9, 2006
- Yamaha Corporation
- Yoshihiro Ohkura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor element and wafer level chip size package therefor
- Publication number 20050199995
- Publication date Sep 15, 2005
- Kentaro Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mount chip package
- Publication number 20040124514
- Publication date Jul 1, 2004
- Yoshihiro Ohkura
- H01 - BASIC ELECTRIC ELEMENTS