Yoshihiro Tomita

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Elementary stream multiplexing method, multiplexing system, encodin...
- Patent number 9,866,898
- Issue date Jan 9, 2018
- Fujitsu Limited
- Kazuhiro Yamashita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor integrated circuit
- Patent number 8,723,574
- Issue date May 13, 2014
- Kabushiki Kaisha Toshiba
- Yoshihiro Tomita
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of fabricating semiconductor device having a chip, reinforci...
- Patent number 7,094,630
- Issue date Aug 22, 2006
- Renesas Technology Corp.
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for laminating and mounting semiconductor chip
- Patent number 6,803,253
- Issue date Oct 12, 2004
- NEC Corporation
- Masamoto Tago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Echo canceler
- Patent number 6,704,415
- Issue date Mar 9, 2004
- Fujitsu Limited
- Hiroshi Katayama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device with a binary alloy bonding layer
- Patent number 6,583,514
- Issue date Jun 24, 2003
- NEC Corporation
- Masamoto Tago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for mounting semiconductor devices
- Patent number 6,528,871
- Issue date Mar 4, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and manufacturing method thereof
- Patent number 6,515,360
- Issue date Feb 4, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hironori Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip, reinforcing plate, and sealing...
- Patent number 6,459,152
- Issue date Oct 1, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiating plate structure and method for manufacturing semiconducto...
- Patent number 6,399,422
- Issue date Jun 4, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a semiconductor element mounted on...
- Patent number 6,344,682
- Issue date Feb 5, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device with convergent lens
- Patent number 6,288,851
- Issue date Sep 11, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,278,190
- Issue date Aug 21, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting semiconductor elements
- Patent number 6,265,244
- Issue date Jul 24, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit electrode connected to a pattern formed on an organic subst...
- Patent number 6,259,161
- Issue date Jul 10, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Qiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode of semiconductor device, method of manufacturing thereof,...
- Patent number 6,184,061
- Issue date Feb 6, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Qiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising stacked semiconductor elements
- Patent number 6,084,294
- Issue date Jul 4, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a heat radiation plate
- Patent number 5,986,336
- Issue date Nov 16, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,959,353
- Issue date Sep 28, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame including frame-cutting slit for lead-on-chip (LOC) semi...
- Patent number 5,900,582
- Issue date May 4, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe including frame-cutting slit for lead-on-chip (LOC) semic...
- Patent number 5,763,829
- Issue date Jun 9, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe for lead-on-chip (LOC) semiconductor device
- Patent number 5,724,726
- Issue date Mar 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,708,304
- Issue date Jan 13, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 5,666,008
- Issue date Sep 9, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly for a semiconductor device
- Patent number 5,637,917
- Issue date Jun 10, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a lead on chip (LOC) semiconductor device
- Patent number 5,535,509
- Issue date Jul 16, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-packaged semiconductor device with flow prevention dimples
- Patent number 5,440,169
- Issue date Aug 8, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, junctioning method, junction material, and semicon...
- Patent number 5,372,295
- Issue date Dec 13, 1994
- Ryoden Semiconductor System Engineering Corporation
- Shunichi Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Relay and exchange system for time division multiplex data
- Patent number 5,291,484
- Issue date Mar 1, 1994
- Fujitsu Limited
- Yoshihiro Tomita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Moden signal detecting system for adaptive differential PCM CODEC
- Patent number 5,202,905
- Issue date Apr 13, 1993
- Fujitsu Limited
- Keizo Sakamoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ELEMENTARY STREAM MULTIPLEXING METHOD, MULTIPLEXING SYSTEM, ENCODIN...
- Publication number 20140369425
- Publication date Dec 18, 2014
- KAZUHIRO YAMASHITA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20120286837
- Publication date Nov 15, 2012
- Kabushiki Kaisha Toshiba
- Yoshihiro TOMITA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SCAN FLIP-FLOP DEVICE
- Publication number 20090300448
- Publication date Dec 3, 2009
- Kabushiki Kaisha Toshiba
- Yoshihiro Tomita
- G01 - MEASURING TESTING
Information Patent Application
Method of manufacturing a solid state image sensing device
- Publication number 20050116138
- Publication date Jun 2, 2005
- Kenji Hanada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device
- Publication number 20050104202
- Publication date May 19, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
External electrode connector
- Publication number 20040104113
- Publication date Jun 3, 2004
- RENESAS TECHNOLOGY CORP.
- Yoshihiro Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device having a chip, reinforcing plate, and sealing...
- Publication number 20030016511
- Publication date Jan 23, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for laminating and mounting semiconductor chip
- Publication number 20020106831
- Publication date Aug 8, 2002
- Masamoto Tago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020090756
- Publication date Jul 11, 2002
- Masamoto Tago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor device and manufacturing method thereof
- Publication number 20010040288
- Publication date Nov 15, 2001
- Hironori Matsushima
- H01 - BASIC ELECTRIC ELEMENTS

Yoshihiro Tomita

Person

Patents Grantslast 30 patents

Elementary stream multiplexing method, multiplexing system, encodin...

Semiconductor integrated circuit

Method of fabricating semiconductor device having a chip, reinforci...

Method for laminating and mounting semiconductor chip

Echo canceler

Semiconductor device with a binary alloy bonding layer

Structure and method for mounting semiconductor devices

Packaged semiconductor device and manufacturing method thereof

Semiconductor device having a chip, reinforcing plate, and sealing...

Radiating plate structure and method for manufacturing semiconducto...

Semiconductor device comprising a semiconductor element mounted on...

Optical semiconductor device with convergent lens

Semiconductor device

Method for mounting semiconductor elements

Circuit electrode connected to a pattern formed on an organic subst...

Electrode of semiconductor device, method of manufacturing thereof,...

Semiconductor device comprising stacked semiconductor elements

Semiconductor device including a heat radiation plate

Semiconductor device

Lead frame including frame-cutting slit for lead-on-chip (LOC) semi...

Leadframe including frame-cutting slit for lead-on-chip (LOC) semic...

Method of making leadframe for lead-on-chip (LOC) semiconductor device

Semiconductor device

Flip chip semiconductor device

Lead frame assembly for a semiconductor device

Method of making a lead on chip (LOC) semiconductor device

Resin-packaged semiconductor device with flow prevention dimples

Solder material, junctioning method, junction material, and semicon...

Relay and exchange system for time division multiplex data

Moden signal detecting system for adaptive differential PCM CODEC

Patents Applicationslast 30 patents

ELEMENTARY STREAM MULTIPLEXING METHOD, MULTIPLEXING SYSTEM, ENCODIN...

SEMICONDUCTOR INTEGRATED CIRCUIT

SCAN FLIP-FLOP DEVICE

Method of manufacturing a solid state image sensing device

Semiconductor device

External electrode connector

Semiconductor device having a chip, reinforcing plate, and sealing...

Method for laminating and mounting semiconductor chip

Semiconductor device and method of manufacturing the same

Packaged semiconductor device and manufacturing method thereof