Yoshihiro Tomita

Person

Tsukuba-Shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with high frequency communication modules h...
- Patent number 11,387,200
- Issue date Jul 12, 2022
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with compound semiconductor device...
- Patent number 11,335,651
- Issue date May 17, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,790,231
- Issue date Sep 29, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 10,741,419
- Issue date Aug 11, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 10,707,171
- Issue date Jul 7, 2020
- Intel Corporation
- Tomita Yoshihiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-mold structures
- Patent number 10,636,716
- Issue date Apr 28, 2020
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with high frequency communication modules h...
- Patent number 10,629,551
- Issue date Apr 21, 2020
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with high frequency communication...
- Patent number 10,573,608
- Issue date Feb 25, 2020
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,418,329
- Issue date Sep 17, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 10,403,512
- Issue date Sep 3, 2019
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shielding for system-in-package techno...
- Patent number 10,163,810
- Issue date Dec 25, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate retention on a reusable carrier
- Patent number 10,111,368
- Issue date Oct 23, 2018
- Intel Corporation
- Yoshihiro Tomita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic particle embedded flex or printed flex for magnetic tray o...
- Patent number 10,070,520
- Issue date Sep 4, 2018
- Intel Corporation
- Yoshihiro Tomita
- A43 - FOOTWEAR
Information Patent Grant
Integrated circuit assembly that includes stacked dice
- Patent number 9,991,243
- Issue date Jun 5, 2018
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wavy interconnect for bendable and stretchable devices
- Patent number 9,942,980
- Issue date Apr 10, 2018
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 9,899,238
- Issue date Feb 20, 2018
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming sacrificial composite materials for package-on-package arch...
- Patent number 9,793,233
- Issue date Oct 17, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Picture frame stiffeners for microelectronic packages
- Patent number 9,685,388
- Issue date Jun 20, 2017
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly that includes stacked dice
- Patent number 9,576,942
- Issue date Feb 21, 2017
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with dielectric or anisotropic conductive (ACF) buildup layer
- Patent number 9,543,197
- Issue date Jan 10, 2017
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Picture frame stiffeners for microelectronic packages
- Patent number 9,502,368
- Issue date Nov 22, 2016
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming sacrificial composite materials for package-on-package arch...
- Patent number 9,472,519
- Issue date Oct 18, 2016
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of connecting a first electronic package to a second electr...
- Patent number 9,263,329
- Issue date Feb 16, 2016
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20240213171
- Publication date Jun 27, 2024
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES
- Publication number 20240063089
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063066
- Publication date Feb 22, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED...
- Publication number 20230282542
- Publication date Sep 7, 2023
- Intel Corporation
- Wenhao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL MATRIX COMPOSITE LAYERS HAVING GRADED FILLER CONTENT FOR HEAT...
- Publication number 20230282543
- Publication date Sep 7, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES
- Publication number 20230094979
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
- Publication number 20230099827
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
- Publication number 20230098710
- Publication date Mar 30, 2023
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES
- Publication number 20230095654
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
- Publication number 20230098303
- Publication date Mar 30, 2023
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
- Publication number 20220246554
- Publication date Aug 4, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20220230892
- Publication date Jul 21, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER FOR ETCHED IDENTIFICATION MARKS ON A PACKAGE
- Publication number 20200388576
- Publication date Dec 10, 2020
- Intel Corporation
- Taylor GAINES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20200350181
- Publication date Nov 5, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20200286834
- Publication date Sep 10, 2020
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...
- Publication number 20200227366
- Publication date Jul 16, 2020
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20190355666
- Publication date Nov 21, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20190341271
- Publication date Nov 7, 2019
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
- Publication number 20190099776
- Publication date Apr 4, 2019
- Ken P. Hackenberg
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...
- Publication number 20180376591
- Publication date Dec 27, 2018
- Intel Corporation
- Yoshihiro Tomita
- A41 - WEARING APPAREL
Information Patent Application
MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...
- Publication number 20180342472
- Publication date Nov 29, 2018
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20180337129
- Publication date Nov 22, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20180337135
- Publication date Nov 22, 2018
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...
- Publication number 20180331051
- Publication date Nov 15, 2018
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MOLD STRUCTURES
- Publication number 20180277458
- Publication date Sep 27, 2018
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
- Publication number 20180240762
- Publication date Aug 23, 2018
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS

Yoshihiro Tomita

Person

Patents Grantslast 30 patents

Low cost package warpage solution

Ultra small molded module integrated with die by module-on-wafer as...

Low cost package warpage solution

Microelectronic devices with high frequency communication modules h...

Microelectronic devices designed with compound semiconductor device...

Low cost package warpage solution

Microelectronic structures having multiple microelectronic devices...

Microelectronic structures having multiple microelectronic devices...

Low cost package warpage solution

Ultra small molded module integrated with die by module-on-wafer as...

Through-mold structures

Microelectronic devices with high frequency communication modules h...

Microelectronic devices designed with high frequency communication...

Microelectronic structures having multiple microelectronic devices...

Low cost package warpage solution

Electromagnetic interference shielding for system-in-package techno...

Flexible substrate retention on a reusable carrier

Magnetic particle embedded flex or printed flex for magnetic tray o...

Integrated circuit assembly that includes stacked dice

Wavy interconnect for bendable and stretchable devices

Low cost package warpage solution

Laser die backside film removal for integrated circuit (IC) packaging

Forming sacrificial composite materials for package-on-package arch...

Picture frame stiffeners for microelectronic packages

Integrated circuit assembly that includes stacked dice

Package with dielectric or anisotropic conductive (ACF) buildup layer

Picture frame stiffeners for microelectronic packages

Forming sacrificial composite materials for package-on-package arch...

Laser die backside film removal for integrated circuit (IC) packaging

Methods of connecting a first electronic package to a second electr...

Patents Applicationslast 30 patents

LOW COST PACKAGE WARPAGE SOLUTION

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES

TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

LOW COST PACKAGE WARPAGE SOLUTION

METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED...

METAL MATRIX COMPOSITE LAYERS HAVING GRADED FILLER CONTENT FOR HEAT...

CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES

TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...

TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...

CONFORMAL POWER DELIVERY STRUCTURES

TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...

MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...

LOW COST PACKAGE WARPAGE SOLUTION

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

LAYER FOR ETCHED IDENTIFICATION MARKS ON A PACKAGE

LOW COST PACKAGE WARPAGE SOLUTION

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

LOW COST PACKAGE WARPAGE SOLUTION

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...

MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...

THROUGH-MOLD STRUCTURES

MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...