Yoshihiro Tomura

Person

Hirakata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, flip-chip mounting method and flip-chip mount...
- Patent number 8,895,359
- Issue date Nov 25, 2014
- Panasonic Corporation
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing mounting structure and mounting structure
- Patent number 8,436,253
- Issue date May 7, 2013
- Panasonic Corporation
- Takayuki Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method...
- Patent number 8,426,965
- Issue date Apr 23, 2013
- Panasonic Corporation
- Teppei Iwase
- B30 - PRESSES
Information Patent Grant
Semiconductor device having stable signal transmission at high spee...
- Patent number 8,415,794
- Issue date Apr 9, 2013
- Panasonic Corporation
- Kentaro Kumazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing structure for electronic component and resin sealing...
- Patent number 8,358,018
- Issue date Jan 22, 2013
- Panasonic Corporation
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly and multilayer wiring board
- Patent number 8,283,570
- Issue date Oct 9, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method...
- Patent number 8,264,079
- Issue date Sep 11, 2012
- Panasonic Corporation
- Teppei Iwase
- B30 - PRESSES
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,207,618
- Issue date Jun 26, 2012
- Panasonic Corporation
- Kazumichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip mounting method, flip-chip mounting apparatus and tool pr...
- Patent number 8,163,599
- Issue date Apr 24, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solder bump, semiconductor chip, method of manufacturing the semico...
- Patent number 8,154,123
- Issue date Apr 10, 2012
- Panasonic Corporation
- Shigeru Kondou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and semiconductor device mou...
- Patent number 8,110,933
- Issue date Feb 7, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounted structure with an underfill sealing-bo...
- Patent number 8,106,521
- Issue date Jan 31, 2012
- Panasonic Corporation
- Teppei Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and mounting method
- Patent number 8,080,884
- Issue date Dec 20, 2011
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,050,049
- Issue date Nov 1, 2011
- Panasonic Corporation
- Teppei Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electrode and electrode component mount...
- Patent number 8,033,016
- Issue date Oct 11, 2011
- Panasonic Corporation
- Kunio Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip and semiconductor device
- Patent number 7,994,638
- Issue date Aug 9, 2011
- Panasonic Corporation
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode junction structure and manufacturing method thereof
- Patent number 7,985,078
- Issue date Jul 26, 2011
- Panasonic Corporation
- Kentaro Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting board and three-dimensional wiring structure using it
- Patent number 7,845,954
- Issue date Dec 7, 2010
- Panasonic Corporation
- Yoshihiro Tomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate connecting member and connecting structure
- Patent number 7,762,819
- Issue date Jul 27, 2010
- Panasonic Corporation
- Masato Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating semiconductor-mounting body and apparatus fo...
- Patent number 6,613,180
- Issue date Sep 2, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yoshitaka Sunagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bump having a rugged side
- Patent number 6,088,236
- Issue date Jul 11, 2000
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of checking electric circuits of semiconductor device and co...
- Patent number 5,940,679
- Issue date Aug 17, 1999
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- G01 - MEASURING TESTING
Information Patent Grant
Method for mounting a semiconductor device on a circuit board using...
- Patent number 5,670,826
- Issue date Sep 23, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a semiconductor device on a circuit board
- Patent number 5,651,179
- Issue date Jul 29, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, a chip carrier, a terminal electrode for a circuit su...
- Patent number 5,640,051
- Issue date Jun 17, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a chip carrier and terminal electrode for a c...
- Patent number 5,628,919
- Issue date May 13, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bump having a rugged side, a semiconductor devi...
- Patent number 5,545,589
- Issue date Aug 13, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary for a wire bonding apparatus and a method for forming an...
- Patent number 5,485,949
- Issue date Jan 23, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...
- Publication number 20120298310
- Publication date Nov 29, 2012
- Teppei Iwase
- B30 - PRESSES
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND MULTILAYER WIRING BOARD
- Publication number 20110279996
- Publication date Nov 17, 2011
- Yoshihiro Tomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, FLIP-CHIP MOUNTING METHOD AND FLIP-CHIP MOUNT...
- Publication number 20110175237
- Publication date Jul 21, 2011
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MOUNTING STRUCTURE AND MOUNTING STRUCTURE
- Publication number 20110061913
- Publication date Mar 17, 2011
- PANASONIC CORPORATION
- Takayuki Higuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20110042808
- Publication date Feb 24, 2011
- Kentaro Kumazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...
- Publication number 20110020983
- Publication date Jan 27, 2011
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOU...
- Publication number 20110001233
- Publication date Jan 6, 2011
- Teppei Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100276803
- Publication date Nov 4, 2010
- PANASONIC CORPORATION
- Takayuki Higuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100265683
- Publication date Oct 21, 2010
- Panasonic Corporation
- Teppei IWASE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER BUMP, SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING THE SEMICO...
- Publication number 20100213609
- Publication date Aug 26, 2010
- PANASONIC CORPORATION
- Shigeru Kondou
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100187675
- Publication date Jul 29, 2010
- PANASONIC CORPORATION
- Kazumichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...
- Publication number 20100181667
- Publication date Jul 22, 2010
- Teppei Iwase
- B30 - PRESSES
Information Patent Application
ELECTRODE JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100167597
- Publication date Jul 1, 2010
- Kentaro KUMAZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20100032832
- Publication date Feb 11, 2010
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOU...
- Publication number 20100025847
- Publication date Feb 4, 2010
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING METHOD
- Publication number 20090321926
- Publication date Dec 31, 2009
- Panasonic Corporation
- Kojiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMP...
- Publication number 20090278265
- Publication date Nov 12, 2009
- Panasonic Corporation
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Connecting Member and Connecting Structure
- Publication number 20090215287
- Publication date Aug 27, 2009
- Masato Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting Board and Three-Dimensional Wiring Structure Using it
- Publication number 20080139013
- Publication date Jun 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protruding Electrode for Connecting Electronic Component, Electroni...
- Publication number 20080135283
- Publication date Jun 12, 2008
- Kunio Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting structure of electronic device
- Publication number 20040140571
- Publication date Jul 22, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yoshihiro Tomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating semiconductor-mounting body and apparatus fo...
- Publication number 20030027371
- Publication date Feb 6, 2003
- Yoshitaka Sunagawa
- H01 - BASIC ELECTRIC ELEMENTS

Yoshihiro Tomura

Person

Patents Grantslast 30 patents

Semiconductor device, flip-chip mounting method and flip-chip mount...

Method of manufacturing mounting structure and mounting structure

Semiconductor device mounted structure and its manufacturing method...

Semiconductor device having stable signal transmission at high spee...

Resin sealing structure for electronic component and resin sealing...

Semiconductor assembly and multilayer wiring board

Semiconductor device mounted structure and its manufacturing method...

Semiconductor device and method of manufacturing the same

Flip-chip mounting method, flip-chip mounting apparatus and tool pr...

Solder bump, semiconductor chip, method of manufacturing the semico...

Semiconductor device mounted structure and semiconductor device mou...

Semiconductor device mounted structure with an underfill sealing-bo...

Mounting structure and mounting method

Semiconductor device

Method for manufacturing an electrode and electrode component mount...

Semiconductor chip and semiconductor device

Electrode junction structure and manufacturing method thereof

Interconnecting board and three-dimensional wiring structure using it

Substrate connecting member and connecting structure

Method for fabricating semiconductor-mounting body and apparatus fo...

Semiconductor device having a bump having a rugged side

Method of checking electric circuits of semiconductor device and co...

Method for mounting a semiconductor device on a circuit board using...

Method for mounting a semiconductor device on a circuit board

Chip package, a chip carrier, a terminal electrode for a circuit su...

Methods for producing a chip carrier and terminal electrode for a c...

Method of forming a bump having a rugged side, a semiconductor devi...

Capillary for a wire bonding apparatus and a method for forming an...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...

SEMICONDUCTOR ASSEMBLY AND MULTILAYER WIRING BOARD

SEMICONDUCTOR DEVICE, FLIP-CHIP MOUNTING METHOD AND FLIP-CHIP MOUNT...

METHOD OF MANUFACTURING MOUNTING STRUCTURE AND MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOU...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SOLDER BUMP, SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING THE SEMICO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...

ELECTRODE JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOU...

MOUNTING STRUCTURE AND MOUNTING METHOD

ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMP...

Substrate Connecting Member and Connecting Structure

Interconnecting Board and Three-Dimensional Wiring Structure Using it

Protruding Electrode for Connecting Electronic Component, Electroni...

Mounting structure of electronic device

Method for fabricating semiconductor-mounting body and apparatus fo...