Yoshihiro TSUTSUMI

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing cured product of heat-curable maleimide resin...
- Patent number 12,264,270
- Issue date Apr 1, 2025
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heat-curable maleimide resin composition
- Patent number 12,162,971
- Issue date Dec 10, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-curable citraconimide resin composition
- Patent number 12,012,485
- Issue date Jun 18, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Bismaleimide compound and production method thereof
- Patent number 11,773,100
- Issue date Oct 3, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yuki Kudo
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Heat-curable resin composition and uses thereof
- Patent number 11,639,410
- Issue date May 2, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroki Horigome
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low-dielectric heat dissipation film composition and low-dielectric...
- Patent number 11,608,438
- Issue date Mar 21, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Slurry composition, cured product of the slurry composition, and su...
- Patent number 11,530,324
- Issue date Dec 20, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Slurry composition, cured product of the slurry composition, and su...
- Patent number 11,267,966
- Issue date Mar 8, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-curable resin composition and semiconductor device
- Patent number 11,059,973
- Issue date Jul 13, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-curable resin composition for semiconductor encapsulation and...
- Patent number 11,046,848
- Issue date Jun 29, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-curable resin composition for semiconductor encapsulation and...
- Patent number 11,001,704
- Issue date May 11, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-curable resin composition, heat-curable resin film and semicon...
- Patent number 10,865,304
- Issue date Dec 15, 2020
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki Kushihara
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Thermosetting epoxy resin sheet for encapsulating semiconductor, se...
- Patent number 10,808,102
- Issue date Oct 20, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-curable resin composition for semiconductor encapsulation and...
- Patent number 10,793,712
- Issue date Oct 6, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber-containing resin substrate, encapsulated semiconductor device...
- Patent number 10,600,707
- Issue date Mar 24, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
White heat-curable epoxy resin composition for optical semiconducto...
- Patent number 10,388,837
- Issue date Aug 20, 2019
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-curable epoxy resin composition for optical semiconductor elem...
- Patent number 10,008,646
- Issue date Jun 26, 2018
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
White heat-curable epoxy resin composition, optical semiconductor e...
- Patent number 9,884,960
- Issue date Feb 6, 2018
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite particle, method of producing same, resin composition con...
- Patent number 9,463,997
- Issue date Oct 11, 2016
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-curable epoxy resin composition for optical semiconductor elem...
- Patent number 9,441,104
- Issue date Sep 13, 2016
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
White thermosetting silicone resin composition for a light-emitting...
- Patent number 9,403,983
- Issue date Aug 2, 2016
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting silicone resin composition for reflector of LED, refl...
- Patent number 8,933,158
- Issue date Jan 13, 2015
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting silicone resin composition for reflector of LED, refl...
- Patent number 8,877,849
- Issue date Nov 4, 2014
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION
- Publication number 20250084205
- Publication date Mar 13, 2025
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION
- Publication number 20250059312
- Publication date Feb 20, 2025
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...
- Publication number 20240247128
- Publication date Jul 25, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...
- Publication number 20240191029
- Publication date Jun 13, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IWASAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BISMALEIMIDE COMPOUND, RESIN VARNISH, AND PRODUCTION METHOD THEREOF
- Publication number 20240182646
- Publication date Jun 6, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yuki KUDO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...
- Publication number 20240117120
- Publication date Apr 11, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE BISMALEIMIDE RESIN COMPOSITION
- Publication number 20240084075
- Publication date Mar 14, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IWASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...
- Publication number 20230416466
- Publication date Dec 28, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING FILM FOR HIGH-SPEED COMMUNICATION BOARD
- Publication number 20230399548
- Publication date Dec 14, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING CURED PRODUCT OF HEAT-CURABLE MALEIMIDE RESIN...
- Publication number 20230340299
- Publication date Oct 26, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION
- Publication number 20230143093
- Publication date May 11, 2023
- Shin-Etsu Chemical Co., Ltd.
- Atsushi TSUURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION FOR RTM, FIBER-REINFORCED...
- Publication number 20230133834
- Publication date May 4, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION, FILM, PREPREG, LAMINATE A...
- Publication number 20230140237
- Publication date May 4, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- B32 - LAYERED PRODUCTS
Information Patent Application
CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COP...
- Publication number 20230130867
- Publication date Apr 27, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOCURABLE MALEIMIDE RESIN COMPOSITION
- Publication number 20230040536
- Publication date Feb 9, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE CITRACONIMIDE RESIN COMPOSITION
- Publication number 20220306808
- Publication date Sep 29, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD (FPC), AND H...
- Publication number 20220306920
- Publication date Sep 29, 2022
- Shin-Etsu Chemical Co., Ltd.
- Atsushi TSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM
- Publication number 20220267526
- Publication date Aug 25, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION
- Publication number 20220195096
- Publication date Jun 23, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTR...
- Publication number 20210371594
- Publication date Dec 2, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yuki KUDO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BISMALEIMIDE COMPOUND AND PRODUCTION METHOD THEREOF
- Publication number 20210246142
- Publication date Aug 12, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yuki KUDO
- C07 - ORGANIC CHEMISTRY
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF
- Publication number 20210189043
- Publication date Jun 24, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MALEIMIDE RESIN COMPOSITION AND MALEIMIDE RESIN FILM
- Publication number 20210079219
- Publication date Mar 18, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM
- Publication number 20210061955
- Publication date Mar 4, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION, AND ADHESIVE AGENT, FILM, PREPREG,...
- Publication number 20210054152
- Publication date Feb 25, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
AROMATIC BISMALEIMIDE COMPOUND, PRODUCTION METHOD THEREOF, AND HEAT...
- Publication number 20210017337
- Publication date Jan 21, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
LOW-DIELECTRIC HEAT DISSIPATION FILM COMPOSITION AND LOW-DIELECTRIC...
- Publication number 20200325334
- Publication date Oct 15, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SLURRY COMPOSITION, CURED PRODUCT OF THE SLURRY COMPOSITION, AND SU...
- Publication number 20200317916
- Publication date Oct 8, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION, HEAT-CURABLE RESIN FILM AND SEMICON...
- Publication number 20200079954
- Publication date Mar 12, 2020
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND...
- Publication number 20200048455
- Publication date Feb 13, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yoshihiro TSUTSUMI

Person

Patents Grantslast 30 patents

Method for producing cured product of heat-curable maleimide resin...

Heat-curable maleimide resin composition

Heat-curable citraconimide resin composition

Bismaleimide compound and production method thereof

Heat-curable resin composition and uses thereof

Low-dielectric heat dissipation film composition and low-dielectric...

Slurry composition, cured product of the slurry composition, and su...

Slurry composition, cured product of the slurry composition, and su...

Heat-curable resin composition and semiconductor device

Heat-curable resin composition for semiconductor encapsulation and...

Heat-curable resin composition for semiconductor encapsulation and...

Heat-curable resin composition, heat-curable resin film and semicon...

Thermosetting epoxy resin sheet for encapsulating semiconductor, se...

Heat-curable resin composition for semiconductor encapsulation and...

Fiber-containing resin substrate, encapsulated semiconductor device...

White heat-curable epoxy resin composition for optical semiconducto...

Heat-curable epoxy resin composition for optical semiconductor elem...

White heat-curable epoxy resin composition, optical semiconductor e...

Composite particle, method of producing same, resin composition con...

Heat-curable epoxy resin composition for optical semiconductor elem...

White thermosetting silicone resin composition for a light-emitting...

Thermosetting silicone resin composition for reflector of LED, refl...

Thermosetting silicone resin composition for reflector of LED, refl...

Patents Applicationslast 30 patents

RESIN COMPOSITION

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION

CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...

HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...

BISMALEIMIDE COMPOUND, RESIN VARNISH, AND PRODUCTION METHOD THEREOF

CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...

HEAT-CURABLE BISMALEIMIDE RESIN COMPOSITION

CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...

BONDING FILM FOR HIGH-SPEED COMMUNICATION BOARD

METHOD FOR PRODUCING CURED PRODUCT OF HEAT-CURABLE MALEIMIDE RESIN...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION FOR RTM, FIBER-REINFORCED...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION, FILM, PREPREG, LAMINATE A...

CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COP...

PHOTOCURABLE MALEIMIDE RESIN COMPOSITION

HEAT-CURABLE CITRACONIMIDE RESIN COMPOSITION

ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD (FPC), AND H...

MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTR...

BISMALEIMIDE COMPOUND AND PRODUCTION METHOD THEREOF

HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF

MALEIMIDE RESIN COMPOSITION AND MALEIMIDE RESIN FILM

MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM

HEAT-CURABLE RESIN COMPOSITION, AND ADHESIVE AGENT, FILM, PREPREG,...

AROMATIC BISMALEIMIDE COMPOUND, PRODUCTION METHOD THEREOF, AND HEAT...

LOW-DIELECTRIC HEAT DISSIPATION FILM COMPOSITION AND LOW-DIELECTRIC...

SLURRY COMPOSITION, CURED PRODUCT OF THE SLURRY COMPOSITION, AND SU...

HEAT-CURABLE RESIN COMPOSITION, HEAT-CURABLE RESIN FILM AND SEMICON...

HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND...