Yoshihisa Imori

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,264,313
- Issue date Mar 1, 2022
- Kabushiki Kaisha Toshiba
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,840,166
- Issue date Nov 17, 2020
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,790,219
- Issue date Sep 29, 2020
- Kabushiki Kaisha Toshiba
- Yoshihisa Imori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,340,207
- Issue date Jul 2, 2019
- Kabushiki Kaisha Toshiba
- Yoshihisa Imori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a light-transmissive insulating body
- Patent number 9,887,311
- Issue date Feb 6, 2018
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,338,904
- Issue date Dec 25, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,880,301
- Issue date Feb 1, 2011
- Kabushiki Kaisha Toshiba
- Yoshihisa Imori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,638,858
- Issue date Dec 29, 2009
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a semiconductor element with a...
- Patent number 7,608,911
- Issue date Oct 27, 2009
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device package having a semic...
- Patent number 7,405,159
- Issue date Jul 29, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,217,640
- Issue date May 15, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a semiconductor element with resin
- Patent number 7,202,563
- Issue date Apr 10, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product plating apparatus
- Patent number 5,397,453
- Issue date Mar 14, 1995
- Kabushiki Kaisha Toshiba
- Yoshihisa Imori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200083150
- Publication date Mar 12, 2020
- Kabushiki Kaisha Toshiba
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190295923
- Publication date Sep 26, 2019
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190273035
- Publication date Sep 5, 2019
- Kabushiki Kaisha Toshiba
- Yoshihisa Imori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180247883
- Publication date Aug 30, 2018
- Kabushiki Kaisha Toshiba
- Yoshihisa Imori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING A LIGHT-TRANSMISSIVE INSULATING BODY
- Publication number 20170244003
- Publication date Aug 24, 2017
- Kabushiki Kaisha Toshiba
- Tetsuya KUROSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110073983
- Publication date Mar 31, 2011
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080265443
- Publication date Oct 30, 2008
- KABUSHIKI KAISHA TOSHIBA,
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20080073780
- Publication date Mar 27, 2008
- Kabushiki Kaisha Toshiba
- Yoshihisa Imori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor element
- Publication number 20080064186
- Publication date Mar 13, 2008
- Kabushiki Kaisha Toshiba
- Yoshihisa Imori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070196956
- Publication date Aug 23, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070187802
- Publication date Aug 16, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050212145
- Publication date Sep 29, 2005
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of dividing a wafer which has a low-k film formed on dicing...
- Publication number 20050202650
- Publication date Sep 15, 2005
- Yoshihisa Imori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050006725
- Publication date Jan 13, 2005
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20030060024
- Publication date Mar 27, 2003
- Kabushiki Kaisha Toshiba
- Yoshihisa Imori
- H01 - BASIC ELECTRIC ELEMENTS

Yoshihisa Imori

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing same

Semiconductor device

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Semiconductor module having a light-transmissive insulating body

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device package having a semiconductor element with a...

Method of fabricating a semiconductor device package having a semic...

Semiconductor device and manufacturing method thereof

Semiconductor device package having a semiconductor element with resin

Semiconductor product plating apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MODULE HAVING A LIGHT-TRANSMISSIVE INSULATING BODY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Manufacturing method of semiconductor element

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Method of dividing a wafer which has a low-k film formed on dicing...

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor device