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YOSHIHISA KAJII

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  • ISHIKAWA, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Minute ball array apparatus
    • Patent number 8,317,076
    • Issue date Nov 27, 2012
    • Shibuya Kogyo Co., Ltd.
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ball array mask and ball array mask supporting apparatus
    • Patent number 8,302,836
    • Issue date Nov 6, 2012
    • Shibuya Kogyo Co., Ltd.
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 8,220,691
    • Issue date Jul 17, 2012
    • Shibuya Kogyo Co., Ltd.
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Conductive ball mounting method, and apparatus therefor
    • Patent number 7,617,962
    • Issue date Nov 17, 2009
    • Shibuya Kogyo Co., Ltd.
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Conductive ball arraying apparatus
    • Patent number 7,607,559
    • Issue date Oct 27, 2009
    • Shibuya Kogyo Co., Ltd.
    • Yoshihisa Kajii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Mount inspection apparatus
    • Patent number 6,657,656
    • Issue date Dec 2, 2003
    • Shibuya Kogyo Co., Ltd.
    • Ryoichi Ueda
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Ball mount apparatus
    • Patent number 6,315,185
    • Issue date Nov 13, 2001
    • Shibuya Kogyo Co., Ltd.
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder ball mounting device
    • Patent number 6,260,259
    • Issue date Jul 17, 2001
    • Shibuya Kogyo Co., Ltd.
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Unit for supplying solder balls
    • Patent number 6,253,985
    • Issue date Jul 3, 2001
    • Shibuya Kogyo Co., Ltd.
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING APPARATUS
    • Publication number 20110174442
    • Publication date Jul 21, 2011
    • Shibuya Kogyo Co. Ltd.
    • Yoshihisa KAJII
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING APPARATUS
    • Publication number 20110121055
    • Publication date May 26, 2011
    • SHIBUYA KOGYO CO., LTD.
    • Yoshihisa KAJII
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BALL ARRAY MASK AND BALL ARRAY MASK SUPPORTING APPARATUS
    • Publication number 20100044412
    • Publication date Feb 25, 2010
    • SHIBUYA KOGYO CO., LTD.
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MINUTE BALL ARRAY APPARATUS
    • Publication number 20100044413
    • Publication date Feb 25, 2010
    • SHIBUYA KOGYO CO., LTD.
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Conductive ball arraying apparatus
    • Publication number 20080302856
    • Publication date Dec 11, 2008
    • Yoshihisa Kajii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Conductive ball mounting method, and apparatus therefor
    • Publication number 20060219755
    • Publication date Oct 5, 2006
    • SHIBUYA KOGYO CO., LTD
    • Yoshihisa Kajii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BALL MOUNT APPARATUS
    • Publication number 20010007330
    • Publication date Jul 12, 2001
    • YOSHIHISA KAJII
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR