Yoshihisa Kawamoto

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die used for resin-sealing and molding an electronic component
- Patent number 6,773,247
- Issue date Aug 10, 2004
- Towa Corporation
- Michio Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for molding resin to seal electronic parts
- Patent number 5,834,035
- Issue date Nov 10, 1998
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of sealing electronic parts with molded resin and mold emplo...
- Patent number 5,753,538
- Issue date May 19, 1998
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing/molding apparatus for electronic parts
- Patent number 5,750,154
- Issue date May 12, 1998
- Towa Corporation
- Keiji Maeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of molding resin to seal electronic parts using two evacuati...
- Patent number 5,603,879
- Issue date Feb 18, 1997
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin molding apparatus for sealing an electronic device
- Patent number 5,507,633
- Issue date Apr 16, 1996
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of molding resin for sealing an electronic device
- Patent number 5,435,953
- Issue date Jul 25, 1995
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
- Publication number 20230364833
- Publication date Nov 16, 2023
- TOWA CORPORATION
- Yoshihisa KAWAMOTO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN MOLDING APPARATUS, COVER PLATE, AND RESIN MOLDED ARTICLE PROD...
- Publication number 20230202079
- Publication date Jun 29, 2023
- TOWA CORPORATION
- Yoshihisa KAWAMOTO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Yoshihisa Kawamoto

Person

Patents Grantslast 30 patents

Die used for resin-sealing and molding an electronic component

Method of and apparatus for molding resin to seal electronic parts

Method of sealing electronic parts with molded resin and mold emplo...

Resin sealing/molding apparatus for electronic parts

Method of molding resin to seal electronic parts using two evacuati...

Resin molding apparatus for sealing an electronic device

Method of molding resin for sealing an electronic device

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE

RESIN MOLDING APPARATUS, COVER PLATE, AND RESIN MOLDED ARTICLE PROD...