-
Lead frame
-
Patent number 5,541,447
-
Issue date Jul 30, 1996
-
Yamaha Corporation
-
Yoshihisa Maejima
-
H01 - BASIC ELECTRIC ELEMENTS
-
Method of electroplating
-
Patent number 5,498,325
-
Issue date Mar 12, 1996
-
Yamaha Corporation
-
Seiya Nishimura
-
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
-
-
Electroplating apparatus
-
Patent number 5,441,620
-
Issue date Aug 15, 1995
-
Yamaha Corporation
-
Seiya Nishimura
-
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
-
Electroplating method and apparatus
-
Patent number 5,431,801
-
Issue date Jul 11, 1995
-
Yamaha Corporation
-
Seiya Nishimura
-
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
-
Method of making lead frame
-
Patent number 5,347,709
-
Issue date Sep 20, 1994
-
Yamaha Corporation
-
Yoshihisa Maejima
-
H01 - BASIC ELECTRIC ELEMENTS