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Yoshihito HAGIWARA
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
PTFE sheet and method for mounting die
Patent number
11,512,411
Issue date
Nov 29, 2022
Shinkawa Ltd.
Osamu Watanabe
D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
11,189,594
Issue date
Nov 30, 2021
Shinkawa Ltd.
Osamu Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip mounting apparatus and semiconductor chip mounti...
Patent number
10,978,420
Issue date
Apr 13, 2021
Shinkawa Ltd.
Yoshihito Hagiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
10,566,307
Issue date
Feb 18, 2020
Shinkawa Ltd.
Yuu Hasegawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball forming device, wire-bonding apparatus, and ball formation method
Patent number
10,410,992
Issue date
Sep 10, 2019
Shinkawa Ltd.
Yoshihito Hagiwara
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing semiconductor device, and wire-bonding apparatus
Patent number
9,922,952
Issue date
Mar 20, 2018
Shinkawa Ltd.
Yoshihito Hagiwara
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonding apparatus and bonding method
Patent number
9,337,166
Issue date
May 10, 2016
Shinkawa Ltd.
Yoshihito Hagiwara
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PTFE SHEET AND METHOD FOR MOUNTING DIE
Publication number
20200291548
Publication date
Sep 17, 2020
SHINKAWA LTD.
Osamu WATANABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...
Publication number
20200251441
Publication date
Aug 6, 2020
SHINKAWA LTD.
Yoshihito HAGIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20200098721
Publication date
Mar 26, 2020
SHINKAWA LTD.
Osamu WATANABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Publication number
20180323166
Publication date
Nov 8, 2018
SHINKAWA LTD.
Yuu HASEGAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND WIRE-BONDING APPARATUS
Publication number
20160365330
Publication date
Dec 15, 2016
SHINKAWA LTD.
Yoshihito HAGIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BALL FORMING DEVICE, WIRE-BONDING APPARATUS, AND BALL FORMATION METHOD
Publication number
20160351538
Publication date
Dec 1, 2016
SHINKAWA LTD.
YOSHIHITO HAGIWARA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
Publication number
20160163673
Publication date
Jun 9, 2016
SHINKAWA LTD.
Yoshihito HAGIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
Publication number
20140138426
Publication date
May 22, 2014
SHINKAWA LTD.
Yoshihito HAGIWARA
H01 - BASIC ELECTRIC ELEMENTS