Yoshihito INABA

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 12,084,599
- Issue date Sep 10, 2024
- Resonac Corporation
- Emi Miyazawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,873,414
- Issue date Jan 16, 2024
- Resonac Corporation
- Yuma Takeuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 11,840,648
- Issue date Dec 12, 2023
- Resonac Corporation
- Emi Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,186,742
- Issue date Nov 30, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,149,164
- Issue date Oct 19, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Takeuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,111,407
- Issue date Sep 7, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...
- Publication number 20240093059
- Publication date Mar 21, 2024
- Resonac Corporation
- Emi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPOR...
- Publication number 20220028722
- Publication date Jan 27, 2022
- Showa Denko Materials Co., Ltd.
- Emi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...
- Publication number 20210363380
- Publication date Nov 25, 2021
- Yuma TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...
- Publication number 20200399506
- Publication date Dec 24, 2020
- HITACHI CHEMICAL COMPANY, LTD.
- Emi MIYAZAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...
- Publication number 20190233672
- Publication date Aug 1, 2019
- Hitachi Chemical Company, Ltd.
- Yuma TAKEUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Yoshihito INABA

Person

Patents Grantslast 30 patents

Semiconductor device manufacturing method, curable resin compositio...

Sealing resin composition, electronic component device, and method...

Semiconductor device manufacturing method, curable resin compositio...

Sealing resin composition, electronic component device, and method...

Sealing resin composition, electronic component device, and method...

Sealing resin composition, electronic component device, and method...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...

SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPOR...

SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...

SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...