Yoshiie Matsumoto

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding-substrate fabrication method, bonding substrate, substrate...
- Patent number 10,166,749
- Issue date Jan 1, 2019
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin substrate, method for manufacturing same, and method for trans...
- Patent number 10,043,975
- Issue date Aug 7, 2018
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding polymer film and polymer film, method for bondin...
- Patent number 9,962,908
- Issue date May 8, 2018
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding-substrate fabrication method, bonding substrate, substrate...
- Patent number 9,601,350
- Issue date Mar 21, 2017
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element sealing method and bonded substrate
- Patent number 9,331,305
- Issue date May 3, 2016
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR JOINING TRANSPARENT SUBSTRATES, AND LAMINATED BODY
- Publication number 20220332637
- Publication date Oct 20, 2022
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo SUGA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR BONDING SUBSTRATE, TRANSPARENT SUBSTRATE LAMINATE, AND D...
- Publication number 20210017075
- Publication date Jan 21, 2021
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo SUGA
- B32 - LAYERED PRODUCTS
Information Patent Application
THIN SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR TRANS...
- Publication number 20170200891
- Publication date Jul 13, 2017
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT SEALING METHOD AND BONDED SUBSTRATE
- Publication number 20150171365
- Publication date Jun 18, 2015
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING POLYMER FILM AND POLYMER FILM, METHOD FOR BONDIN...
- Publication number 20150104656
- Publication date Apr 16, 2015
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...
- Publication number 20140037945
- Publication date Feb 6, 2014
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- B32 - LAYERED PRODUCTS
Information Patent Application
Dielectric barrier discharge excimer light source
- Publication number 20080061669
- Publication date Mar 13, 2008
- Sen Engineering Co., Ltd.
- Mikhail I LOMAEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric barrier diescharge excimer light source
- Publication number 20080054773
- Publication date Mar 6, 2008
- Sen Engineering Co., Ltd.
- Mikhail I LOMAEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric barrier discharge excimer light source
- Publication number 20080054791
- Publication date Mar 6, 2008
- Sen Engineering Co., Ltd.
- Mikhail I LOMAEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Barrier Discharge Excimer Light Source
- Publication number 20070210713
- Publication date Sep 13, 2007
- Sen Engineering Co., Ltd.
- Mikhail I. Lomaev
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiie Matsumoto

Person

Patents Grantslast 30 patents

Bonding-substrate fabrication method, bonding substrate, substrate...

Thin substrate, method for manufacturing same, and method for trans...

Method for bonding polymer film and polymer film, method for bondin...

Bonding-substrate fabrication method, bonding substrate, substrate...

Electronic element sealing method and bonded substrate

Patents Applicationslast 30 patents

METHOD FOR JOINING TRANSPARENT SUBSTRATES, AND LAMINATED BODY

METHOD FOR BONDING SUBSTRATE, TRANSPARENT SUBSTRATE LAMINATE, AND D...

THIN SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR TRANS...

ELECTRONIC ELEMENT SEALING METHOD AND BONDED SUBSTRATE

METHOD FOR BONDING POLYMER FILM AND POLYMER FILM, METHOD FOR BONDIN...

BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...

Dielectric barrier discharge excimer light source

Dielectric barrier diescharge excimer light source

Dielectric barrier discharge excimer light source

Dielectric Barrier Discharge Excimer Light Source