Yoshikatsu SHIRAOKAWA

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Chiyoda-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition and its production method, prepreg,...
- Patent number 11,136,454
- Issue date Oct 5, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Keisuke Kushida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin varnish, prepreg, laminate, and printed wiring board
- Patent number 10,940,674
- Issue date Mar 9, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yoshikatsu Shiraokawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE A...
- Publication number 20210267052
- Publication date Aug 26, 2021
- Showa Denko Materials Co., Ltd.
- Yoshikatsu SHIRAOKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND ITS PRODUCTION METHOD, PREPREG,...
- Publication number 20200002526
- Publication date Jan 2, 2020
- Hitachi Chemical Company, Ltd.
- Keisuke KUSHIDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN VARNISH, PREPREG, LAMINATE, AND PRINTED WIRING BOARD
- Publication number 20190338093
- Publication date Nov 7, 2019
- Hitachi Chemical Company, Ltd.
- Yoshikatsu SHIRAOKAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...