Yoshikazu Hirabayashi

Follow

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 10,290,570
- Issue date May 14, 2019
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,121,695
- Issue date Nov 6, 2018
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having lead pin, and lead pin
- Patent number 8,379,402
- Issue date Feb 19, 2013
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Oshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic package for semiconductor device
- Patent number 5,080,980
- Issue date Jan 14, 1992
- Shinko Electric Industries Co., Ltd.
- Noboru Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20180218972
- Publication date Aug 2, 2018
- Shinko Electric Industries Co., Ltd.
- Tadashi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180218941
- Publication date Aug 2, 2018
- Shinko Electric Industries Co., Ltd.
- Tadashi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD HAVING LEAD PIN, AND LEAD PIN
- Publication number 20100139970
- Publication date Jun 10, 2010
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Oshima
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PGA TYPE WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090211798
- Publication date Aug 27, 2009
- Shinko Electric Industries Co., Ltd.
- Akio Horiuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...