YOSHIKAZU HIRANO

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KAWASAKI-SHI, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate on which electronic component is soldered, electronic dev...
- Patent number 10,299,387
- Issue date May 21, 2019
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component analyzing apparatus and method
- Patent number 8,701,488
- Issue date Apr 22, 2014
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component analyzing apparatus and method
- Patent number 8,656,777
- Issue date Feb 25, 2014
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB with soldering pad projections forming fillet solder joints and...
- Patent number 8,338,715
- Issue date Dec 25, 2012
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting semiconductor chip part on substrate
- Patent number 6,482,676
- Issue date Nov 19, 2002
- Fujitsu Limited
- Kazuhisa Tsunoi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...
- Publication number 20180343748
- Publication date Nov 29, 2018
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT ANALYZING APPARATUS AND METHOD
- Publication number 20120017679
- Publication date Jan 26, 2012
- Fujitsu Limited
- Yoshikazu HIRANO
- G01 - MEASURING TESTING
Information Patent Application
Printed circuit board and method of production of an electronic app...
- Publication number 20090056985
- Publication date Mar 5, 2009
- FUJITSU LIMITED
- Yoshikazu Hirano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIP PART ON SUBSTRATE
- Publication number 20020048847
- Publication date Apr 25, 2002
- KAZUHISA TSUNOI
- H01 - BASIC ELECTRIC ELEMENTS