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Yoshikazu IDENO
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Yamanashi, JP
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last 30 patents
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Patent Grant
Semiconductor film forming method using hydrazine-based compound gas
Patent number
11,348,794
Issue date
May 31, 2022
Tokyo Electron Limited
Hideo Nakamura
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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last 30 patents
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Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
Publication number
20190378723
Publication date
Dec 12, 2019
TOKYO ELECTRON LIMITED
Hideo Nakamura
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
FILM FORMING APPARATUS AND FILM FORMING METHOD
Publication number
20180112312
Publication date
Apr 26, 2018
TOKYO ELECTRON LIMITED
Masaya ODAGIRI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...