Yoshikazu Kumagaya

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 8,810,043
- Issue date Aug 19, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board for flip-chip mounting, mounting structure of electron...
- Patent number 8,659,168
- Issue date Feb 25, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 8,076,769
- Issue date Dec 13, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,076,785
- Issue date Dec 13, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relay board provided in semiconductor device, semiconductor device,...
- Patent number 7,973,404
- Issue date Jul 5, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recognition method of a mark provided on a semiconductor device
- Patent number 6,869,819
- Issue date Mar 22, 2005
- Fujitsu Limited
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a BGA-type semiconductor device having reliable e...
- Patent number 6,457,633
- Issue date Oct 1, 2002
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor having through hole
- Patent number 6,291,895
- Issue date Sep 18, 2001
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an external connection electrode extend...
- Patent number 6,281,571
- Issue date Aug 28, 2001
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor having through hole
- Patent number 5,953,592
- Issue date Sep 14, 1999
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20140061887
- Publication date Mar 6, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110278723
- Publication date Nov 17, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090243092
- Publication date Oct 1, 2009
- Fujitsu Microelectronics Limited
- Takao NISHIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD, MOUNTING STRUCTURE FOR ELECTRONIC COMPONENTS, AND SEM...
- Publication number 20080224325
- Publication date Sep 18, 2008
- Fujitsu Limited
- Takao NISHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Relay board provided in semiconductor device, semiconductor device,...
- Publication number 20070132102
- Publication date Jun 14, 2007
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060289972
- Publication date Dec 28, 2006
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recognition method of a mark provided on a semiconductor device
- Publication number 20030224540
- Publication date Dec 4, 2003
- FUJITSU LIMITED
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor having through hole
- Publication number 20010028101
- Publication date Oct 11, 2001
- FUJITSU LIMITED
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS

Yoshikazu Kumagaya

Person

Patents Grantslast 30 patents

Semiconductor device

Wiring board for flip-chip mounting, mounting structure of electron...

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device

Relay board provided in semiconductor device, semiconductor device,...

Recognition method of a mark provided on a semiconductor device

Method of forming a BGA-type semiconductor device having reliable e...

Method of fabricating semiconductor having through hole

Semiconductor device having an external connection electrode extend...

Method of fabricating semiconductor having through hole

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

WIRING BOARD, MOUNTING STRUCTURE FOR ELECTRONIC COMPONENTS, AND SEM...

Relay board provided in semiconductor device, semiconductor device,...

Semiconductor device

Recognition method of a mark provided on a semiconductor device

Method of fabricating semiconductor having through hole