Yoshikazu Oshika

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Si-doped GaAs single crystal ingot and process for producing the sa...
- Patent number 8,986,446
- Issue date Mar 24, 2015
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- C30 - CRYSTAL GROWTH
Information Patent Grant
Solder layer and device bonding substrate using the same and method...
- Patent number 8,747,579
- Issue date Jun 10, 2014
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Submount
- Patent number 8,581,106
- Issue date Nov 12, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder layer, substrate for device joining utilizing the same and m...
- Patent number 8,516,692
- Issue date Aug 27, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Submount and method of manufacturing the same
- Patent number 8,472,208
- Issue date Jun 25, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder layer and electronic device bonding substrate and submount u...
- Patent number 8,404,359
- Issue date Mar 26, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder layer, heat sink using such a solder layer and method for ma...
- Patent number 8,310,047
- Issue date Nov 13, 2012
- Dowa Electronics Materials Co., Ltd.
- Masayuki Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting semiconductor
- Patent number 7,800,096
- Issue date Sep 21, 2010
- Dowa Electronics Materials Co., Ltd.
- Yutaka Ohta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Submount and Method of Manufacturing the Same
- Publication number 20120012373
- Publication date Jan 19, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Si-Doped GaAs single crystal ingot and process for producing the sa...
- Publication number 20110059294
- Publication date Mar 10, 2011
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yoshikazu Oshika
- C30 - CRYSTAL GROWTH
Information Patent Application
SOLDER LAYER, HEAT SINK USING SUCH A SOLDER LAYER AND METHOD FOR MA...
- Publication number 20100263849
- Publication date Oct 21, 2010
- Masayuki Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Submount and Method of Manufacturing the Same
- Publication number 20090207580
- Publication date Aug 20, 2009
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CERAMIC COMPOSITE SUBSTRATE AND METHOD OF ITS MANUFACTURE
- Publication number 20090151982
- Publication date Jun 18, 2009
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Si-Doped GaAs Single Crystal Ingot and Process for Producing the Sa...
- Publication number 20090098377
- Publication date Apr 16, 2009
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yoshikazu Oshika
- C30 - CRYSTAL GROWTH
Information Patent Application
SOLDER LAYER, SUBSTRATE FOR DEVICE JOINING UTILIZING THE SAME AND M...
- Publication number 20090095513
- Publication date Apr 16, 2009
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER LAYER AND DEVICE BONDING SUBSTRATE USING THE SAME AND METHOD...
- Publication number 20080205013
- Publication date Aug 28, 2008
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yoshikazu OSHIKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER LAYER AND ELECTRONIC DEVICE BONDING SUBSTRATE AND SUBMOUNT U...
- Publication number 20070228105
- Publication date Oct 4, 2007
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Yoshikazu Oshika

Person

Patents Grantslast 30 patents

Si-doped GaAs single crystal ingot and process for producing the sa...

Solder layer and device bonding substrate using the same and method...

Submount

Solder layer, substrate for device joining utilizing the same and m...

Submount and method of manufacturing the same

Solder layer and electronic device bonding substrate and submount u...

Solder layer, heat sink using such a solder layer and method for ma...

Light emitting semiconductor

Patents Applicationslast 30 patents

Submount and Method of Manufacturing the Same

Si-Doped GaAs single crystal ingot and process for producing the sa...

SOLDER LAYER, HEAT SINK USING SUCH A SOLDER LAYER AND METHOD FOR MA...

Submount and Method of Manufacturing the Same

METAL-CERAMIC COMPOSITE SUBSTRATE AND METHOD OF ITS MANUFACTURE

Si-Doped GaAs Single Crystal Ingot and Process for Producing the Sa...

SOLDER LAYER, SUBSTRATE FOR DEVICE JOINING UTILIZING THE SAME AND M...

SOLDER LAYER AND DEVICE BONDING SUBSTRATE USING THE SAME AND METHOD...

SOLDER LAYER AND ELECTRONIC DEVICE BONDING SUBSTRATE AND SUBMOUNT U...