Yoshikazu Sakano

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Chita, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a trench with a rounded bottom in a semiconductor...
- Patent number 6,521,538
- Issue date Feb 18, 2003
- Denso Corporation
- Hajime Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etching method for semiconductor substrate
- Patent number 6,090,718
- Issue date Jul 18, 2000
- Denso Corporation
- Hajime Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etching process for semiconductor
- Patent number 5,871,659
- Issue date Feb 16, 1999
- Nippondenso Co., Ltd.
- Yoshikazu Sakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etching process for semiconductor
- Patent number 5,522,966
- Issue date Jun 4, 1996
- Nippondenso Co., Ltd.
- Atsushi Komura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etching process for semiconductor
- Patent number 5,423,941
- Issue date Jun 13, 1995
- Nippondenso Co., Ltd.
- Atsushi Komura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing semiconductor device and insulated gate ty...
- Publication number 20010023960
- Publication date Sep 27, 2001
- Hajime Soga
- H01 - BASIC ELECTRIC ELEMENTS