Yoshiki AKIYAMA

Follow

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,057,384
- Issue date Aug 6, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi Taneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate
- Patent number 11,792,927
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Rie Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,716,810
- Issue date Aug 1, 2023
- Shinko Electric Industries Co., Ltd.
- Masaya Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20230066839
- Publication date Mar 2, 2023
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE
- Publication number 20230054390
- Publication date Feb 23, 2023
- Shinko Electric Industries Co., Ltd.
- Rie MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20220361340
- Publication date Nov 10, 2022
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20220361331
- Publication date Nov 10, 2022
- Shinko Electric Industries Co., Ltd.
- Masaya TAKIZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20220157697
- Publication date May 19, 2022
- Shinko Electric Industries Co., LTD.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS