Yoshiki Kawazu

Person

Kyoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
High-frequency board, high-frequency package, and high-frequency mo...
- Patent number 12,273,990
- Issue date Apr 8, 2025
- Kyocera Corporation
- Yoshiki Kawazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency board, high-frequency package, and high-frequency mo...
- Patent number 11,758,648
- Issue date Sep 12, 2023
- Kyocera Corporation
- Yoshiki Kawazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency board, high-frequency package, and high-frequency mo...
- Patent number 11,102,880
- Issue date Aug 24, 2021
- Kyocera Corporation
- Yoshiki Kawazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency board, high-frequency package, and high-frequency mo...
- Patent number 10,869,387
- Issue date Dec 15, 2020
- Kyocera Corporation
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element package, semiconductor device, and mounting s...
- Patent number 10,068,818
- Issue date Sep 4, 2018
- Kyocera Corporation
- Yoshiki Kawazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, electronic component housing package, and electronic...
- Patent number 10,051,725
- Issue date Aug 14, 2018
- KYOCERA Corporation
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component containing package and electronic device
- Patent number 10,014,233
- Issue date Jul 3, 2018
- Kyocera Corporation
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package and electronic device
- Patent number 9,935,025
- Issue date Apr 3, 2018
- Kyocera Corporation
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package, and electronic device compris...
- Patent number 9,922,925
- Issue date Mar 20, 2018
- KYOCERA Corporation
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element-accommodating package and mounting structure
- Patent number 9,805,995
- Issue date Oct 31, 2017
- KYOCERA Corporation
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element housing package and mounting structure body
- Patent number 9,462,709
- Issue date Oct 4, 2016
- KYOCERA Corporation
- Yoshiki Kawazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component housing package and electronic apparatus
- Patent number 9,386,687
- Issue date Jul 5, 2016
- KYOCERA Corporation
- Mahiro Tsujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BO...
- Publication number 20250056726
- Publication date Feb 13, 2025
- KYOCERA CORPORATION
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, WIRING STRUCTURE USING WIRING SUBSTRATE, ELECTRON...
- Publication number 20240105600
- Publication date Mar 28, 2024
- Kyocera Corporation
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BASE AND ELECTRONIC DEVICE
- Publication number 20240074035
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...
- Publication number 20230380052
- Publication date Nov 23, 2023
- Kyocera Corporation
- Yoshiki KAWAZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20230307331
- Publication date Sep 28, 2023
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...
- Publication number 20210368616
- Publication date Nov 25, 2021
- Kyocera Corporation
- Yoshiki KAWAZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...
- Publication number 20200337150
- Publication date Oct 22, 2020
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...
- Publication number 20190246495
- Publication date Aug 8, 2019
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT PACKAGE, SEMICONDUCTOR DEVICE, AND MOUNTING S...
- Publication number 20180130718
- Publication date May 10, 2018
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT CONTAINING PACKAGE AND ELECTRONIC DEVICE
- Publication number 20170323836
- Publication date Nov 9, 2017
- KYOCERA CORPORATION
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HOUSING PACKAGE, AND ELECTRONIC DEVICE COMPRIS...
- Publication number 20170133315
- Publication date May 11, 2017
- KYOCERA CORPORATION
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC DEVICE
- Publication number 20170069556
- Publication date Mar 9, 2017
- KYOCERA CORPORATION
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT-ACCOMMODATING PACKAGE AND MOUNTING STRUCTURE
- Publication number 20160343628
- Publication date Nov 24, 2016
- KYOCERA CORPORATION
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC COMPONENT HOUSING PACKAGE, AND ELECTRONIC...
- Publication number 20160120026
- Publication date Apr 28, 2016
- KYOCERA CORPORATION
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE BODY
- Publication number 20150173214
- Publication date Jun 18, 2015
- KYOCERA CORPORATION
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS
- Publication number 20140345929
- Publication date Nov 27, 2014
- Mahiro Tsujino
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiki Kawazu

Person

Patents Grantslast 30 patents

High-frequency board, high-frequency package, and high-frequency mo...

High-frequency board, high-frequency package, and high-frequency mo...

High-frequency board, high-frequency package, and high-frequency mo...

High-frequency board, high-frequency package, and high-frequency mo...

Semiconductor element package, semiconductor device, and mounting s...

Circuit board, electronic component housing package, and electronic...

Electronic component containing package and electronic device

Electronic component housing package and electronic device

Electronic component housing package, and electronic device compris...

Element-accommodating package and mounting structure

Element housing package and mounting structure body

Electronic component housing package and electronic apparatus

Patents Applicationslast 30 patents

WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BO...

WIRING SUBSTRATE, WIRING STRUCTURE USING WIRING SUBSTRATE, ELECTRON...

WIRING BASE AND ELECTRONIC DEVICE

HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...

WIRING SUBSTRATE AND ELECTRONIC DEVICE

HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...

HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...

HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...

SEMICONDUCTOR ELEMENT PACKAGE, SEMICONDUCTOR DEVICE, AND MOUNTING S...

ELECTRONIC COMPONENT CONTAINING PACKAGE AND ELECTRONIC DEVICE

ELECTRONIC COMPONENT HOUSING PACKAGE, AND ELECTRONIC DEVICE COMPRIS...

ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC DEVICE

ELEMENT-ACCOMMODATING PACKAGE AND MOUNTING STRUCTURE

CIRCUIT BOARD, ELECTRONIC COMPONENT HOUSING PACKAGE, AND ELECTRONIC...

ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE BODY

ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS