Yoshiki OOE

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Amidinate compound, dimer compound thereof, thin-film forming raw m...
- Patent number 12,275,748
- Issue date Apr 15, 2025
- Adeka Corporation
- Tomoharu Yoshino
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
THIN-FILM FORMING RAW MATERIAL, WHICH IS USED IN ATOMIC LAYER DEPOS...
- Publication number 20240167154
- Publication date May 23, 2024
- ADEKA CORPORATION
- Atsushi SAKURAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TIN COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, METHOD FOR...
- Publication number 20240167155
- Publication date May 23, 2024
- ADEKA CORPORATION
- Tomoharu YOSHINO
- C07 - ORGANIC CHEMISTRY
Information Patent Application
METHOD OF PRODUCING THIN-FILM
- Publication number 20240018654
- Publication date Jan 18, 2024
- ADEKA CORPORATION
- Akihiro NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PRODUCING THIN-FILM
- Publication number 20240018655
- Publication date Jan 18, 2024
- ADEKA CORPORATION
- Akihiro NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AMIDINATE COMPOUND, DIMER COMPOUND THEREOF, THIN-FILM FORMING RAW M...
- Publication number 20230151041
- Publication date May 18, 2023
- ADEKA CORPORATION
- Tomoharu YOSHINO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NOVEL TIN COMPOUND, THIN-FILM FORMING RAW MATERIAL CONTAINING SAID...
- Publication number 20230002423
- Publication date Jan 5, 2023
- ADEKA CORPORATION
- Tomoharu YOSHINO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yoshiki OOE

Person

Patents Grantslast 30 patents

Amidinate compound, dimer compound thereof, thin-film forming raw m...

Patents Applicationslast 30 patents

THIN-FILM FORMING RAW MATERIAL, WHICH IS USED IN ATOMIC LAYER DEPOS...

TIN COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, METHOD FOR...

METHOD OF PRODUCING THIN-FILM

METHOD OF PRODUCING THIN-FILM

AMIDINATE COMPOUND, DIMER COMPOUND THEREOF, THIN-FILM FORMING RAW M...

NOVEL TIN COMPOUND, THIN-FILM FORMING RAW MATERIAL CONTAINING SAID...