Yoshiki Yabuhara

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Itami-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of packaging compound semiconductor substrates
- Patent number 8,381,493
- Issue date Feb 26, 2013
- Sumitomo Electric Industries, Ltd.
- Takayuki Nishiura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
Method of Packaging Compound Semiconductor Substrates
- Publication number 20090249747
- Publication date Oct 8, 2009
- Sumitomo Electric Industries, Ltd.
- Takayuki Nishiura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL