Yoshiko KOHNO

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,328,534
- Issue date Jun 25, 2019
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal nanoparticle dispersion, method for producing metal nanoparti...
- Patent number 9,662,748
- Issue date May 30, 2017
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20160136763
- Publication date May 19, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOPARTICLE DISPERSION, METHOD FOR PRODUCING METAL NANOPARTI...
- Publication number 20160101486
- Publication date Apr 14, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR