Yoshikuni Nakadaira

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip assembly and method for making same
- Patent number 9,716,075
- Issue date Jul 25, 2017
- Tessera, Inc.
- Teck-Gyu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a fan-out WLP with package
- Patent number 9,337,165
- Issue date May 10, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly and method for making same
- Patent number 9,137,903
- Issue date Sep 15, 2015
- Tessera, Inc.
- Teck-Gyu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assembly comprising dielectric structures with diff...
- Patent number 8,957,520
- Issue date Feb 17, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out microelectronic unit WLP having interconnects comprising a...
- Patent number 8,890,304
- Issue date Nov 18, 2014
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with sintered connections to package
- Patent number 8,525,338
- Issue date Sep 3, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bent electrode terminal
- Patent number 5,763,946
- Issue date Jun 9, 1998
- Kabushiki Kaisha Toshiba
- Yoshikuni Nakadaira
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor chip assembly and method for making same
- Publication number 20170309593
- Publication date Oct 26, 2017
- Tessera, Inc.
- Teck-Gyu KANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fan-out WLP with package
- Publication number 20160254247
- Publication date Sep 1, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME
- Publication number 20160005711
- Publication date Jan 7, 2016
- Tessera, Inc.
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out WLP With Package
- Publication number 20150044824
- Publication date Feb 12, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME
- Publication number 20120313238
- Publication date Dec 13, 2012
- Tessera Research LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WLP WITH PACKAGE
- Publication number 20120313253
- Publication date Dec 13, 2012
- Tessera, Inc.
- Yoshikuni Nakadaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WITH SINTERED CONNECTIONS TO PACKAGE
- Publication number 20120313264
- Publication date Dec 13, 2012
- Teresa, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME
- Publication number 20120286416
- Publication date Nov 15, 2012
- Tessera Research LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME
- Publication number 20120155055
- Publication date Jun 21, 2012
- Tessera, Inc.
- Teck-Gyu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yoshikuni Nakadaira

Person

Patents Grantslast 30 patents

Semiconductor chip assembly and method for making same

Method for manufacturing a fan-out WLP with package

Semiconductor chip assembly and method for making same

Microelectronic assembly comprising dielectric structures with diff...

Fan-out microelectronic unit WLP having interconnects comprising a...

Chip with sintered connections to package

Semiconductor device with bent electrode terminal

Patents Applicationslast 30 patents

Semiconductor chip assembly and method for making same

Fan-out WLP with package

SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME

Fan-Out WLP With Package

SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME

FAN-OUT WLP WITH PACKAGE

CHIP WITH SINTERED CONNECTIONS TO PACKAGE

SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME

SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME