Yoshimi Egawa

Person

Miyazaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed-circuit board
- Patent number 8,500,984
- Issue date Aug 6, 2013
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and the semiconductor...
- Patent number 8,435,839
- Issue date May 7, 2013
- Lapis Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package semiconductor device
- Patent number 8,314,492
- Issue date Nov 20, 2012
- Lapis Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and method of manufacturing camera module
- Patent number 8,202,391
- Issue date Jun 19, 2012
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device having stress relaxation sections
- Patent number 8,143,718
- Issue date Mar 27, 2012
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming laminated structure and method for manufacturing...
- Patent number 8,138,023
- Issue date Mar 20, 2012
- Lapis Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a package base with at least one throug...
- Patent number 7,898,086
- Issue date Mar 1, 2011
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,781,880
- Issue date Aug 24, 2010
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,646,086
- Issue date Jan 12, 2010
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricating method
- Patent number 7,560,302
- Issue date Jul 14, 2009
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 7,413,925
- Issue date Aug 19, 2008
- Oki Electric Inductry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,317,244
- Issue date Jan 8, 2008
- Oki Electric Industry Co., Ltd.
- Yasufumi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi chip package
- Patent number 7,215,031
- Issue date May 8, 2007
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for stacked multi-chip package
- Patent number 7,179,685
- Issue date Feb 20, 2007
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,002,251
- Issue date Feb 21, 2006
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,995,038
- Issue date Feb 7, 2006
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,870,249
- Issue date Mar 22, 2005
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a chip connected to a wiring substrate u...
- Patent number 6,867,069
- Issue date Mar 15, 2005
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip package, process for fabrication of chip structu...
- Patent number 6,777,797
- Issue date Aug 17, 2004
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a chip connected to a wiring substrate u...
- Patent number 6,635,963
- Issue date Oct 21, 2003
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,426,554
- Issue date Jul 30, 2002
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making a plurality of flip chip packages with a wafer s...
- Patent number 6,376,278
- Issue date Apr 23, 2002
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad for stress releif between a substrate and an external subs...
- Patent number 6,259,163
- Issue date Jul 10, 2001
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices having solder bumps w...
- Patent number 6,251,704
- Issue date Jun 26, 2001
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,229,215
- Issue date May 8, 2001
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,204,563
- Issue date Mar 20, 2001
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for packaging semiconductor chip
- Patent number 6,130,480
- Issue date Oct 10, 2000
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 5,994,168
- Issue date Nov 30, 1999
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 5,863,815
- Issue date Jan 26, 1999
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE, AND...
- Publication number 20110024904
- Publication date Feb 3, 2011
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20100065953
- Publication date Mar 18, 2010
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Camera module and method of manufacturing camera module
- Publication number 20100038017
- Publication date Feb 18, 2010
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20100025710
- Publication date Feb 4, 2010
- Oki Semiconductor Co., Ltd.
- Shigeru Yamada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MANUFACTURING PRINTED-CIRCUIT BOARD
- Publication number 20090321266
- Publication date Dec 31, 2009
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor device and the semiconductor...
- Publication number 20090209062
- Publication date Aug 20, 2009
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricating method
- Publication number 20070231966
- Publication date Oct 4, 2007
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor package
- Publication number 20070184583
- Publication date Aug 9, 2007
- Oki Electric Industry Co., Ltd.
- Yoshimi EGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20070075413
- Publication date Apr 5, 2007
- Oki Electric Industry Co., Ltd.
- Yoshimi EGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LAMINATED STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20060223232
- Publication date Oct 5, 2006
- Oki Electric Industry Co., Ltd.
- Yoshimi EGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060220261
- Publication date Oct 5, 2006
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through electrode, package base having through electrode, and semic...
- Publication number 20060202347
- Publication date Sep 14, 2006
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi chip package
- Publication number 20060097374
- Publication date May 11, 2006
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050046035
- Publication date Mar 3, 2005
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050026418
- Publication date Feb 3, 2005
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method for stacked multi-chip package
- Publication number 20050006746
- Publication date Jan 13, 2005
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040119162
- Publication date Jun 24, 2004
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with a chip connected to a wiring substrate u...
- Publication number 20040023438
- Publication date Feb 5, 2004
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked multi-chip package, process for fabrication of chip structu...
- Publication number 20040000723
- Publication date Jan 1, 2004
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030132516
- Publication date Jul 17, 2003
- Yasufumi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making semiconductor device
- Publication number 20020119599
- Publication date Aug 29, 2002
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS

Yoshimi Egawa

Person

Patents Grantslast 30 patents

Method for manufacturing printed-circuit board

Method of manufacturing semiconductor device and the semiconductor...

Semiconductor package and package-on-package semiconductor device

Camera module and method of manufacturing camera module

Semiconductor device having stress relaxation sections

Method for forming laminated structure and method for manufacturing...

Semiconductor device having a package base with at least one throug...

Semiconductor package

Semiconductor package

Semiconductor device fabricating method

Method for fabricating semiconductor package

Semiconductor device and manufacturing method thereof

Multi chip package

Fabrication method for stacked multi-chip package

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor package with a chip connected to a wiring substrate u...

Stacked multi-chip package, process for fabrication of chip structu...

Semiconductor package with a chip connected to a wiring substrate u...

Semiconductor device

Methods for making a plurality of flip chip packages with a wafer s...

Bond pad for stress releif between a substrate and an external subs...

Method of manufacturing semiconductor devices having solder bumps w...

Semiconductor device and manufacturing method thereof

Semiconductor device

Structure for packaging semiconductor chip

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE, PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE, AND...

Semiconductor package

Camera module and method of manufacturing camera module

Semiconductor device and fabrication method thereof

METHOD FOR MANUFACTURING PRINTED-CIRCUIT BOARD

Method of manufacturing semiconductor device and the semiconductor...

Semiconductor device fabricating method

Method for fabricating semiconductor package

Semiconductor package

METHOD FOR FORMING LAMINATED STRUCTURE AND METHOD FOR MANUFACTURING...

Semiconductor device

Through electrode, package base having through electrode, and semic...

Multi chip package

Semiconductor device

Method of manufacturing semiconductor device

Fabrication method for stacked multi-chip package

Semiconductor device and manufacturing method thereof

Semiconductor package with a chip connected to a wiring substrate u...

Stacked multi-chip package, process for fabrication of chip structu...

Semiconductor device and manufacturing method thereof

Method for making semiconductor device