Yoshimi Inagawa

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Adachi-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bi—Sn based high-temperature solder alloy
- Patent number 9,205,513
- Issue date Dec 8, 2015
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bi-Sn Based High-Temperature Solder Alloy
- Publication number 20130121874
- Publication date May 16, 2013
- Minoru Ueshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...